IGLD60R070D1 IGLD60R070D1 600V CoolGaN enhancement-mode Power Transistor Features Enhancement mode transistor Normally OFF switch Ultra fast switching No reverse-recovery charge G SK Capable of reverse conduction S S Low gate charge, low output charge D D Superior commutation ruggedness D D Qualified for industrial applications according to JEDEC 1 S S Standards (JESD47 and JESD22) SK G 8 Benefits Gate 8 Improves system efficiency Drain 1,2,3,4 Improves power density Kelvin Source 7 Enables higher operating frequency Source 5,6 System cost reduction savings Reduces EMI Applications Industrial, telecom, datacenter SMPS based on the half-bridge topology (half-bridge topologies for hard and soft switching such as Totem pole PFC, high frequency LLC). For other applications: review CoolGaN reliability white paper and contact Infineon regional support Table 1 Key Performance Parameters at T = 25 C j Parameter Value Unit V 600 V DS,max R 70 m DS(on),max QG,typ 5.8 nC I 60 A D,pulse Q 400 V 41 nC oss Q 0 nC rr Table 2 Ordering Information Type / Ordering Code Package Marking Related links IGLD60R070D1 PG-LSON-8-1 60R070D1 see Appendix A Final Data Sheet Please read the Important Notice and Warnings at the end of this document Rev. 2.12 www.infineon.com 2021-04-27 IGLD60R070D1 600V CoolGaN enhancement-mode Power Transistor Table of Contents Features .................................................................................................................................. 1 Benefits .................................................................................................................................. 1 Applications ................................................................................................................................... 1 Table of Contents ........................................................................................................................... 2 1 Maximum ratings ........................................................................................................... 3 2 Thermal characteristics .................................................................................................. 4 3 Electrical characteristics ................................................................................................ 5 4 Electrical characteristics diagrams .................................................................................. 7 5 Test Circuits ................................................................................................................. 13 6 Package Outlines .......................................................................................................... 14 7 Appendix A ................................................................................................................... 15 8 Revision History ........................................................................................................... 16 Final Data Sheet 2 Rev. 2.12 2021-04-27