X-On Electronics has gained recognition as a prominent supplier of IRF1324PBF MOSFETs across the USA, India, Europe, Australia, and various other global locations. IRF1324PBF MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

IRF1324PBF Infineon

IRF1324PBF electronic component of Infineon
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See Product Specifications
Part No.IRF1324PBF
Manufacturer: Infineon
Category: MOSFETs
Description: Transistor: N-MOSFET; unipolar; 24V; 353A; 300W; TO220AB
Datasheet: IRF1324PBF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.576 ea
Line Total: USD 2.58 
Availability - 1558
Ship by Tue. 15 Oct to Thu. 17 Oct
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
471
Ship by Wed. 09 Oct to Tue. 15 Oct
MOQ : 1
Multiples : 1
1 : USD 3.7537
10 : USD 2.1688
100 : USD 1.9336
500 : USD 1.7169
1000 : USD 1.7085

1
Ship by Wed. 16 Oct to Mon. 21 Oct
MOQ : 1
Multiples : 1
1 : USD 2.0934
10 : USD 2.0419
50 : USD 2.0075
100 : USD 1.975

1558
Ship by Tue. 15 Oct to Thu. 17 Oct
MOQ : 1
Multiples : 1
1 : USD 2.576
10 : USD 1.656
100 : USD 1.38
500 : USD 1.334
1000 : USD 1.2765

90
Ship by Wed. 09 Oct to Tue. 15 Oct
MOQ : 1
Multiples : 1
1 : USD 3.444
9 : USD 2.268
10 : USD 2.17
23 : USD 2.156
50 : USD 2.072

366
Ship by Wed. 09 Oct to Tue. 15 Oct
MOQ : 6
Multiples : 1
6 : USD 2.2126
10 : USD 1.7527
100 : USD 1.6238
500 : USD 1.4965
1000 : USD 1.427
2000 : USD 1.3907
5000 : USD 1.3767

4850
Ship by Wed. 09 Oct to Tue. 15 Oct
MOQ : 1000
Multiples : 1000
1000 : USD 1.8038

893
Ship by Wed. 09 Oct to Tue. 15 Oct
MOQ : 21
Multiples : 1
21 : USD 2.0435
50 : USD 1.943
100 : USD 1.7588
200 : USD 1.6918
500 : USD 1.675

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Gate Charge Qg
Factory Pack Quantity :
Configuration
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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We are delighted to provide the IRF1324PBF from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRF1324PBF and other electronic components in the MOSFETs category and beyond.

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IRF1324PbF HEXFET Power MOSFET Applications D V 24V DSS High Efficiency Synchronous Rectification in SMPS R typ. 1.2m Uninterruptible Power Supply DS(on) High Speed Power Switching max. 1.5m Hard Switched and High Frequency Circuits G I 353A D (Silicon Limited) I 195A S D (Package Limited) Benefits Improved Gate, Avalanche and Dynamic dV/dt Ruggedness Fully Characterized Capacitance and Avalanche SOA Enhanced body diode dV/dt and dI/dt Capability S Lead-Free D G TO-220AB IRF1324PbF GD S Gate Drain Source Absolute Maximum Ratings Symbol Parameter Max. Units I T = 25C Continuous Drain Current, V 10V (Silicon Limited) 353 D C GS I T = 100C Continuous Drain Current, V 10V (Silicon Limited) 249 D C GS A I T = 25C Continuous Drain Current, V 10V (Wire Bond Limited) 195 D C GS I 1412 Pulsed Drain Current DM P T = 25C Maximum Power Dissipation 300 W D C Linear Derating Factor 2.0 W/C V 20 Gate-to-Source Voltage V GS dv/dt Peak Diode Recovery 0.46 V/ns T Operating Junction and J -55 to + 175 T Storage Temperature Range STG C Soldering Temperature, for 10 seconds 300 (1.6mm from case) Avalanche Characteristics E Single Pulse Avalanche Energy 270 mJ AS (Thermally limited) I See Fig. 14, 15, 22a, 22b Avalanche Current A AR E Repetitive Avalanche Energy mJ AR Thermal Resistance Symbol Parameter Typ. Max. Units R Junction-to-Case 0.50 JC C/W R Case-to-Sink, Flat Greased Surface 0.50 CS R Junction-to-Ambient 62 JA www.irf.com 1 09/24/09 Static T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions V V = 0V, I = 250A Drain-to-Source Breakdown Voltage 24 V (BR)DSS GS D Reference to 25C, I = 5.0mA V /T Breakdown Voltage Temp. Coefficient 22 mV/C D (BR)DSS J R V = 10V, I = 195A Static Drain-to-Source On-Resistance 1.2 1.5 m DS(on) GS D V = V , I = 250A V Gate Threshold Voltage 2.0 4.0 V DS GS D GS(th) V = 24V, V = 0V I Drain-to-Source Leakage Current 20 A DS GS DSS V = 24V, V = 0V, T = 125C 250 DS GS J I Gate-to-Source Forward Leakage 200 nA V = 20V GS GSS V = -20V Gate-to-Source Reverse Leakage -200 GS R Internal Gate Resistance 2.3 G Dynamic T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions V = 10V, I = 195A gfs Forward Transconductance 180 S DS D Q I = 195A Total Gate Charge 160 240 g D Q V = 12V Gate-to-Source Charge 84 gs DS nC Q V = 10V Gate-to-Drain Mille) Charge 49 gd GS Total Gate Charge Sync. (Q - Q ) I = 195A, V =0V, V = 10V Q 76 sync g gd D DS GS t V = 16V Turn-On Delay Time 17 d(on) DD I = 195A t Rise Time 190 D r ns t Turn-Off Delay Time 83 R = 2.7 d(off) G V = 10V t Fall Time 120 GS f C Input Capacitance 7590 V = 0V GS iss V = 24V C Output Capacitance 3440 DS oss C pF = 1.0 MHz, See Fig. 5 Reverse Transfer Capacitance 1960 rss C eff. (ER) V = 0V, V = 0V to 19V , See Fig. 11 Effective Output Capacitance (Energy Related) 4700 oss GS DS C eff. (TR) V = 0V, V = 0V to 19V Effective Output Capacitance (Time Related) 4490 oss GS DS Diode Characteristics Symbol Parameter Min. Typ. Max. Units Conditions D I MOSFET symbol Continuous Source Current S 353 (Body Diode) showing the A G I integral reverse Pulsed Source Current SM 1412 S (Body Diode) p-n junction diode. T = 25C, I = 195A, V = 0V V Diode Forward Voltage 1.3 V J S GS SD t T = 25C V = 20V, Reverse Recovery Time 46 rr J R ns T = 125C I = 195A 71 J F Q T = 25C Reverse Recovery Charge 160 di/dt = 100A/s rr J nC T = 125C 430 J I T = 25C Reverse Recovery Current 7.7 A RRM J t Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) on Calcuted continuous current based on maximum allowable junction Pulse width 400s duty cycle 2%. temperature Bond wire current limit is 195A. Note that current C eff. (TR) is a fixed capacitance that gives the same charging time limitation arising from heating of the device leds may occur with oss some lead mounting arrangements. as C while V is rising from 0 to 80% V . oss DS DSS Repetitive rating pulse width limited by max. junction C eff. (ER) is a fixed capacitance that gives the same energy as oss temperature. C while V is rising from 0 to 80% V . oss DS DSS Limited by T , starting T = 25C, L = 0.014mH Jmax J R = 25, I = 195A, V =10V. Part not recommended for use G AS GS above this value . I 195A, di/dt 450 A/s, V V , T 175C. SD DD (BR)DSS J 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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