X-On Electronics has gained recognition as a prominent supplier of IRFB4615PBF MOSFETs across the USA, India, Europe, Australia, and various other global locations. IRFB4615PBF MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

IRFB4615PBF Infineon

Hot IRFB4615PBF electronic component of Infineon
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See Product Specifications
Part No.IRFB4615PBF
Manufacturer: Infineon
Category: MOSFETs
Description: Transistor: N-MOSFET; unipolar; 150V; 35A; 144W; TO220AB
Datasheet: IRFB4615PBF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
10: USD 0.8291 ea
Line Total: USD 8.29 
Availability - 679
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ: 10  Multiples: 1
Pack Size: 1
Availability Price Quantity
396
Ship by Thu. 05 Dec to Tue. 10 Dec
MOQ : 1
Multiples : 1
1 : USD 2.2454
10 : USD 1.9752
50 : USD 1.4708
100 : USD 1.2983
500 : USD 1.2197
1000 : USD 1.1852

1695
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 1.397
10 : USD 1.144
100 : USD 0.9394
250 : USD 0.924
500 : USD 0.8437
1000 : USD 0.836

38
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 2.352
3 : USD 2.1
10 : USD 1.764
15 : USD 1.218
39 : USD 1.148

1271670
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1000
Multiples : 1000
1000 : USD 1.0614

970
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 46
Multiples : 1
46 : USD 2.1553
50 : USD 2.0731
100 : USD 2.0028
250 : USD 1.9421
500 : USD 1.8892
1000 : USD 1.843

679
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 10
Multiples : 1
10 : USD 0.8291
5000 : USD 0.8239

864
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 38
Multiples : 1
38 : USD 1.079
50 : USD 1.0742
100 : USD 1.0725
200 : USD 1.0677
500 : USD 1.066

1935
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 75
Multiples : 1
75 : USD 1.618

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Gate Charge Qg
Factory Pack Quantity :
Configuration
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
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We are delighted to provide the IRFB4615PBF from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRFB4615PBF and other electronic components in the MOSFETs category and beyond.

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96171 IRFB4615PbF HEXFET Power MOSFET Applications D V 150V DSS High Efficiency Synchronous Rectification in SMPS R typ. 32m Uninterruptible Power Supply DS(on) High Speed Power Switching G max. 39m Hard Switched and High Frequency Circuits I 35A D S Benefits Improved Gate, Avalanche and Dynamic dV/dt Ruggedness Fully Characterized Capacitance and Avalanche SOA Enhanced body diode dV/dt and dI/dt Capability Lead-Free TO-220AB IRFB4615PbF GD S Gate Drain Source Absolute Maximum Ratings Symbol Parameter Max. Units I T = 25C Continuous Drain Current, V 10V 35 D C GS I T = 100C Continuous Drain Current, V 10V 25 A D C GS I 140 DM Pulsed Drain Current P T = 25C W Maximum Power Dissipation 144 D C Linear Derating Factor 0.96 W/C V 20 V Gate-to-Source Voltage GS Peak Diode Recovery 38 dv/dt V/ns T -55 to + 175 J Operating Junction and T Storage Temperature Range STG C 300 Soldering Temperature, for 10 seconds (1.6mm from case) 10lb in (1.1N m) Mounting torque, 6-32 or M3 screw Avalanche Characteristics Single Pulse Avalanche Energy E 109 mJ AS (Thermally limited) Avalanche Current I See Fig. 14, 15, 22a, 22b, A AR Repetitive Avalanche Energy E mJ AR Thermal Resistance Symbol Parameter Typ. Max. Units R Junction-to-Case 1.045 JC R Case-to-Sink, Flat, Greased Surface 0.50 C/W CS R 62 JA Junction-to-Ambient (PCB Mount) www.irf.com 1 09/05/08 Static T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions V Drain-to-Source Breakdown Voltage 150 V V = 0V, I = 250A (BR)DSS GS D V /T Breakdown Voltage Temp. Coefficient 0.19 V/C Reference to 25C, I = 5mA (BR)DSS J D R Static Drain-to-Source On-Resistance 32 39 V = 10V, I = 21A DS(on) m GS D V Gate Threshold Voltage 3.0 5.0 V V = V , I = 100A GS(th) DS GS D I Drain-to-Source Leakage Current 20 V = 150V, V = 0V DSS DS GS A 250 V = 150V, V = 0V, T = 125C DS GS J I Gate-to-Source Forward Leakage 100 V = 20V GSS GS nA Gate-to-Source Reverse Leakage -100 V = -20V GS R Internal Gate Resistance 2.7 G(int) Dynamic T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions gfs Forward Transconductance 35 S V = 50V, I = 21A DS D Q Total Gate Charge 26 I = 21A g D Q Gate-to-Source Charge 8.6 V = 75V gs DS nC Q Gate-to-Drain Mille) Charge 9.0 V = 10V gd GS Q Total Gate Charge Sync. (Q - Q ) 17 I = 21A, V =0V, V = 10V sync g gd D DS GS t Turn-On Delay Time 15 V = 98V d(on) DD t Rise Time 35 I = 21A r D ns t Turn-Off Delay Time 25 R = 7.3 d(off) G t Fall Time 20 V = 10V f GS C Input Capacitance 1750 V = 0V iss GS C Output Capacitance 155 V = 50V oss DS C Reverse Transfer Capacitance 40 pF = 1.0MHz (See Fig.5) rss C eff. (ER) 179 V = 0V, V = 0V to 120V (See Fig.11) oss Effective Output Capacitance (Energy Related) GS DS C eff. (TR) 382 V = 0V, V = 0V to 120V oss Effective Output Capacitance (Time Related) GS DS Diode Characteristics Symbol Parameter Min. Typ. Max. Units Conditions D I Continuous Source Current MOSFET symbol S 35 (Body Diode) showing the A G I Pulsed Source Current integral reverse SM 140 S (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 21A, V = 0V SD J S GS t Reverse Recovery Time 70 T = 25C V = 100V, rr J R ns T = 125C I = 21A 83 J F di/dt = 100A/s Q T = 25C Reverse Recovery Charge 177 rr J nC 247 T = 125C J I T = 25C Reverse Recovery Current 4.9 A RRM J t Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) on Repetitive rating pulse width limited by max. junction C eff. (TR) is a fixed capacitance that gives the same charging time oss temperature. as C while V is rising from 0 to 80% V . oss DS DSS Limited by T , starting T = 25C, L = 0.51mH Jmax J C eff. (ER) is a fixed capacitance that gives the same energy as oss R = 25, I = 21A, V =10V. Part not recommended for use G AS GS C while V is rising from 0 to 80% V . oss DS DSS above this value . When mounted on 1 square PCB (FR-4 or G-10 Material). For recom I 21A, di/dt 549A/s, V V , T 175C. SD DD (BR)DSS J mended footprint and soldering techniques refer to application Pulse width 400s duty cycle 2%. note AN-994 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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