PD - 95144 IRFL4310PbF HEXFET Power MOSFET D Surface Mount V = 100V DSS Dynamic dv/dt Rating Fast Switching Ease of Paralleling R = 0.20 DS(on) Advanced Process Technology G Ultra Low On-Resistance I = 1.6A Lead-Free D S Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick- SOT-223 and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application. Absolute Maximum Ratings Parameter Max. Units I T = 25C Continuous Drain Current, V 10V** 2.2 D A GS I T = 25C Continuous Drain Current, V 10V* 1.6 D A GS A I T = 70C Continuous Drain Current, V 10V* 1.3 D A GS I Pulsed Drain Current 13 DM P T = 25C Power Dissipation (PCB Mount)** 2.1 W D A P T = 25C Power Dissipation (PCB Mount)* 1.0 W D A Linear Derating Factor (PCB Mount)* 8.3 mW/C V Gate-to-Source Voltage 20 V GS E Single Pulse Avalanche Energy 47 mJ AS I Avalanche Current 1.6 A AR E Repetitive Avalanche Energy * 0.10 mJ AR dv/dt Peak Diode Recovery dv/dt 5.0 V/ns T T Junction and Storage Temperature Range -55 to + 150 C J, STG Thermal Resistance Parameter Typ. Max. Units R Junction-to-Amb. (PCB Mount, steady state)* 93 120 JA C/W R Junction-to-Amb. (PCB Mount, steady state)** 48 60 JA * When mounted on FR-4 board using minimum recommended footprint. ** When mounted on 1 inch square copper board, for comparison with other SMD devices. www.irf.com 1 04/22/04IRFL4310PbF Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions V Drain-to-Source Breakdown Voltage 100 V V = 0V, I = 250A (BR)DSS GS D V /T Breakdown Voltage Temp. Coefficient 0.12 V/C Reference to 25C, I = 1mA (BR)DSS J D 0.20 V = 10V, I = 1.6A GS D R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage 2.0 4.0 V V = V , I = 250A GS(th) DS GS D g Forward Transconductance 1.5 S V = 50V, I = 0.80 A fs DS D 25 V = 100V, V = 0V DS GS I Drain-to-Source Leakage Current DSS A 250 V = 80V, V = 0V, T = 125C DS GS J Gate-to-Source Forward Leakage 100 V = 20V GS I nA GSS Gate-to-Source Reverse Leakage -100 V = -20V GS Q Total Gate Charge 17 25 I = 1.6A g D Q Gate-to-Source Charge 2.1 3.1 nC V = 80V gs DS Q Gate-to-Drain Mille) Charge 7.8 12 V = 10V, See Fig. 6 and 13 gd GS t Turn-On Delay Time 7.8 V = 50V d(on) DD t Rise Time 18 I = 1.6A r D ns t Turn-Off Delay Time 34 R = 6.2 d(off) G t Fall Time 20 R = 31 , See Fig. 10 f D C Input Capacitance 330 V = 0V iss GS C Output Capacitance 92 pF V = 25V oss DS C Reverse Transfer Capacitance 54 = 1.0MHz, See Fig. 5 rss Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Conditions I Continuous Source Current MOSFET symbol S 0.91 (Body Diode) showing the A I Pulsed Source Current integral reverse SM 13 (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 1.6A, V = 0V SD J S GS t Reverse Recovery Time 72 110 ns T = 25C, I = 1.6A rr J F Q Reverse RecoveryCharge 210 320 nC di/dt = 100A/s rr Notes: Repetitive rating pulse width limited by I 1.6A, di/dt 340A/s, V V , SD DD (BR)DSS max. junction temperature. ( See fig. 11 ) T 150C J V = 25V, starting T = 25C, L = 9.2 mH DD J Pulse width 300s duty cycle 2%. R = 25, I = 3.2A. (See Figure 12) G AS 2 www.irf.com