X-On Electronics has gained recognition as a prominent supplier of IRFS3307ZTRRPBF MOSFETs across the USA, India, Europe, Australia, and various other global locations. IRFS3307ZTRRPBF MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

IRFS3307ZTRRPBF Infineon

IRFS3307ZTRRPBF electronic component of Infineon
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Part No.IRFS3307ZTRRPBF
Manufacturer: Infineon
Category: MOSFETs
Description: MOSFET 75V 1 N-CH HEXFET 5.8mOhms 79nC
Datasheet: IRFS3307ZTRRPBF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
800: USD 1.4469 ea
Line Total: USD 1157.52 
Availability - 0
MOQ: 800  Multiples: 800
Pack Size: 800
Availability Price Quantity
0
Ship by Fri. 15 Nov to Thu. 21 Nov
MOQ : 800
Multiples : 800
800 : USD 1.4469
4800 : USD 1.4347

0
Ship by Fri. 15 Nov to Thu. 21 Nov
MOQ : 800
Multiples : 800
800 : USD 1.288

0
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 1
Multiples : 1
1 : USD 4.8237
10 : USD 1.6729
100 : USD 1.4676
250 : USD 1.4266
500 : USD 1.2932
800 : USD 1.1905
2400 : USD 1.1392
4800 : USD 1.1084
9600 : USD 1.1084

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Height
Length
Transistor Type
Width
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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We are delighted to provide the IRFS3307ZTRRPBF from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRFS3307ZTRRPBF and other electronic components in the MOSFETs category and beyond.

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IRFB3307ZPbF IRFS3307ZPbF Applications IRFSL3307ZPbF High Efficiency Synchronous Rectification in SMPS HEXFET Power MOSFET Uninterruptible Power Supply High Speed Power Switching D V 75V DSS Hard Switched and High Frequency Circuits R typ. 4.6m DS(on) max. 5.8m G I 128A D (Silicon Limited) Benefits I 120A S D (Package Limited) Improved Gate, Avalanche and Dynamic dv/dt Ruggedness D Fully Characterized Capacitance and D D Avalanche SOA Enhanced body diode dV/dt and dI/dt S Capability S S D D G G G 2 TO-220AB D Pak TO-262 IRFB3307ZPbF IRFS3307ZPbF IRFSL3307ZPbF GD S Gate Drain Source Absolute Maximum Ratings Symbol Parameter Max. Units I T = 25C Continuous Drain Current, V 10V (Silicon Limited) 128 D C GS I T = 100C Continuous Drain Current, VGS 10V (Silicon Limited) 90 A D C I T = 25C Continuous Drain Current, V 10V (Wire Bond Limited) 120 D C GS I Pulsed Drain Current 512 DM P T = 25C 230 W Maximum Power Dissipation D C Linear Derating Factor 1.5 W/C V 20 V GS Gate-to-Source Voltage dv/dt Peak Diode Recovery 6.7 V/ns T -55 to + 175 C J Operating Junction and T Storage Temperature Range STG Soldering Temperature, for 10 seconds 300 (1.6mm from case) Mounting torque, 6-32 or M3 screw 10lbf in (1.1N m) Avalanche Characteristics Single Pulse Avalanche Energy E 140 mJ AS (Thermally limited) Avalanche Current I See Fig. 14, 15, 22a, 22b A AR Repetitive Avalanche Energy E mJ AR Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 0.65 R Case-to-Sink, Flat Greased Surface , TO-220 0.50 C/W CS R 62 JA Junction-to-Ambient, TO-220 2 R 40 JA Junction-to-Ambient (PCB Mount) , D Pak www.irf.com 1 08/19/11 Static T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions V Drain-to-Source Breakdown Voltage 75 V V = 0V, I = 250 A (BR)DSS GS D V /T Breakdown Voltage Temp. Coefficient 0.094 V/C Reference to 25C, I = 5mA (BR)DSS J D R Static Drain-to-Source On-Resistance 4.6 5.8 V = 10V, I = 75A DS(on) m GS D V Gate Threshold Voltage 2.0 4.0 V V = V , I = 150 A GS(th) DS GS D R Internal Gate Resistance 0.70 G(int) I Drain-to-Source Leakage Current 20 A V = 75V, V = 0V DSS DS GS 250 V = 75V, V = 0V, T = 125C DS GS J I Gate-to-Source Forward Leakage 100 nA V = 20V GSS GS Gate-to-Source Reverse Leakage -100 V = -20V GS Dynamic T = 25C (unless otherwise specified) J Symbol Parameter Min. Typ. Max. Units Conditions gfs Forward Transconductance 320 S V = 50V, I = 75A DS D Q Total Gate Charge 79 110 nC I = 75A g D Q Gate-to-Source Charge 19 V = 38V gs DS Q Gate-to-Drain Mille) Charge 24 V = 10V gd GS Q Total Gate Charge Sync. (Q - Q ) 55 I = 75A, V =0V, V = 10V sync g gd D DS GS t Turn-On Delay Time 15 ns V = 49V d(on) DD t Rise Time 64 I = 75A r D t Turn-Off Delay Time 38 R = 2.6 d(off) G t Fall Time 65 V = 10V f GS C Input Capacitance 4750 pF V = 0V iss GS C Output Capacitance 420 V = 50V oss DS C Reverse Transfer Capacitance 190 = 1.0MHz rss C eff. (ER) Effective Output Capacitance (Energy Related) 440 V = 0V, V = 0V to 60V oss GS DS C eff. (TR) 410 V = 0V, V = 0V to 60V oss Effective Output Capacitance (Time Related) GS DS Diode Characteristics Symbol Parameter Min. Typ. Max. Units Conditions D I Continuous Source Current A MOSFET symbol 128 S (Body Diode) showing the G I Pulsed Source Current 512 integral reverse SM S (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 75A, V = 0V SD J S GS t T = 25C V = 64V, Reverse Recovery Time 33 50 ns rr J R T = 125C I = 75A 39 59 J F di/dt = 100A/ s Q Reverse Recovery Charge 42 63 nC T = 25C rr J T = 125C 56 84 J I T = 25C Reverse Recovery Current 2.2 A RRM J t Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) on Calculated continuous current based on maximum allowable junction I 75A, di/dt 1570A/ s, V V , T 175C. SD DD (BR)DSS J Pulse width 400s duty cycle 2%. temperature. Bond wire current limit is 120A. Note that current limitations arising from heating of the device leads may occur with C eff. (TR) is a fixed capacitance that gives the same charging time oss some lead mounting arrangements. as C while V is rising from 0 to 80% V . oss DS DSS Repetitive rating pulse width limited by max. junction C eff. (ER) is a fixed capacitance that gives the same energy as oss temperature. C while V is rising from 0 to 80% V . oss DS DSS Limited by T , starting T = 25C, L = 0.050mH When mounted on 1 square PCB (FR-4 or G-10 Material). For recom Jmax J mended footprint and soldering techniques refer to application note AN-994. R = 25, I = 75A, V =10V. Part not recommended for use G AS GS R is measured at T approximately 90C. J above this value. 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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