X-On Electronics has gained recognition as a prominent supplier of IRFS4020TRLPBF MOSFET across the USA, India, Europe, Australia, and various other global locations. IRFS4020TRLPBF MOSFET are a product manufactured by Infineon. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

IRFS4020TRLPBF Infineon

IRFS4020TRLPBF electronic component of Infineon
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See Product Specifications
Part No.IRFS4020TRLPBF
Manufacturer: Infineon
Category: MOSFET
Description: Transistor: N-MOSFET; unipolar; 200V; 18A; 100W; D2PAK
Datasheet: IRFS4020TRLPBF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.9142 ea
Line Total: USD 0.91

Availability - 8790
Ship by Wed. 31 Jul to Fri. 02 Aug
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
97
Ship by Thu. 25 Jul to Wed. 31 Jul
MOQ : 1
Multiples : 1
1 : USD 1.1671
10 : USD 1.1154
100 : USD 1.1069
500 : USD 1.0562
1000 : USD 1.0481
5000 : USD 1.04

8790
Ship by Wed. 31 Jul to Fri. 02 Aug
MOQ : 1
Multiples : 1
1 : USD 0.9142
10 : USD 0.9142
800 : USD 0.9142
9600 : USD 0.9073

768
Ship by Thu. 25 Jul to Wed. 31 Jul
MOQ : 34
Multiples : 1
34 : USD 1.2302
50 : USD 1.2074
100 : USD 1.1927

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Qg - Gate Charge
Configuration
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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We are delighted to provide the IRFS4020TRLPBF from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRFS4020TRLPBF and other electronic components in the MOSFET category and beyond.

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IRFS4020PbF IRFSL4020PbF Features Key Parameters Key parameters optimized for Class-D audio V 200 V DS amplifier applications m R typ. 10V 85 DS(ON) Low R for improved efficiency DSON Q typ. 18 nC g Low Q and Q for better THD and improved Q typ. 6.7 nC G SW sw R typ. 3.2 efficiency G(int) T max 175 C J Low Q for better THD and lower EMI RR 175C operating junction temperature for D D ruggedness D Can deliver up to 300W per channel into 8 load in half-bridge configuration amplifier S S D D G G G 2 D Pak TO-262 S IRFS4020PbF IRFSL4020PbF GD S Gate Drain Source Description This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD and EMI. Additional features of this MOSFET are 175C operating junction temperature and repetitive avalanche capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for ClassD audio amplifier applications. Absolute Maximum Ratings Parameter Max. Units V Drain-to-Source Voltage 200 V DS V Gate-to-Source Voltage 20 GS I T = 25C Continuous Drain Current, V 10V 18 A D C GS I T = 100C Continuous Drain Current, V 10V 13 D C GS Pulsed Drain Current I 52 DM Power Dissipation P T = 25C 100 W D C Power Dissipation P T = 100C 52 D C Linear Derating Factor 0.70 W/C T Operating Junction and -55 to + 175 J T Storage Temperature Range C STG Soldering Temperature, for 10 seconds 300 (1.6mm from case) Thermal Resistance Parameter Typ. Max. Units Junction-to-Case R 1.43 C/W JC Junction-to-Ambient (PCB Mount) R 40 JA Notes through are on page 2 www.irf.com 1 05/14/09 Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions BV Drain-to-Source Breakdown Voltage 200 V V = 0V, I = 250A DSS GS D V / T Breakdown Voltage Temp. Coefficient 0.23 V/C Reference to 25C, I = 1mA DSS J D m R Static Drain-to-Source On-Resistance 85 105 V = 10V, I = 11A DS(on) GS D V Gate Threshold Voltage 3.0 4.9 V V = V , I = 100A GS(th) DS GS D V / T Gate Threshold Voltage Coefficient -13 mV/C GS(th) J I Drain-to-Source Leakage Current 20 A V = 200V, V = 0V DSS DS GS 250 V = 200V, V = 0V, T = 125C DS GS J I Gate-to-Source Forward Leakage 100 nA V = 20V GSS GS Gate-to-Source Reverse Leakage -100 V = -20V GS g Forward Transconductance 24 S V = 50V, I = 11A fs DS D Q Total Gate Charge 18 29 g Q Pre-Vth Gate-to-Source Charge 4.5 V = 100V gs1 DS Q Post-Vth Gate-to-Source Charge 1.4 nC V = 10V gs2 GS Q Gate-to-Drain Charge 5.3 I = 11A gd D Q Gate Charge Overdrive 6.8 See Fig. 6 and 18 godr Q Switch Charge (Q + Q ) 6.7 sw gs2 gd R Internal Gate Resistance 3.2 G(int) t Turn-On Delay Time 7.8 V = 100V, V = 10V d(on) DD GS t Rise Time 12 I = 11A r D t Turn-Off Delay Time 16 ns R = 2.4 d(off) G t Fall Time 6.3 f C Input Capacitance 1200 V = 0V iss GS C Output Capacitance 91 pF V = 50V oss DS C Reverse Transfer Capacitance 20 = 1.0MHz, See Fig.5 rss C eff. Effective Output Capacitance 110 V = 0V, V = 0V to 160V oss GS DS L Internal Drain Inductance 4.5 Between lead, D D nH 6mm (0.25in.) G L Internal Source Inductance 7.5 from package S S and center of die contact Avalanche Characteristics Parameter Typ. Max. Units Single Pulse Avalanche Energy E 94 mJ AS Avalanche Current I See Fig. 14, 15, 16a, 16b A AR Repetitive Avalanche Energy E mJ AR Diode Characteristics Parameter Min. Typ. Max. Units Conditions I T = 25C Continuous Source Current 18 MOSFET symbol S C (Body Diode) A showing the I Pulsed Source Current 52 integral reverse SM (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 11A, V = 0V SD J S GS t Reverse Recovery Time 82 120 ns T = 25C, I = 11A rr J F Q Reverse Recovery Charge 280 420 nC di/dt = 100A/s rr Repetitive rating pulse width limited by max. junction temperature. R is measured at Starting T = 25C, L = 1.62mH, R = 25 , I = 11A. Limited by Tjmax. See Figs. 14, 15, 17a, 17b for repetitive J G AS Pulse width 400s duty cycle 2%. avalanche information. 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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