BSS 209PW OptiMOS -P Small-Signal-Transistor Product Summary Features V -20 V DS P-Channel R 550 m DS(on),max Enhancement mode I -0.63 A D Super Logic level ( 2.5 V rated) 150C operating temperature PG-SOT-323 Avalanche rated dv /dt rated Pb-free lead plating RoHS compliant Qualified according to AEC Q101 Halogen-free according to IEC61249-2-21 Type Package Tape and Reel Information Marking Lead free Packing BSS 209PW SOT-323 H6327: 1000 pcs/reel X3s Yes Non Dry =25 C, unless otherwise specified Maximum ratings, at T j Value Parameter Symbol Conditions Unit Continuous drain current I T =25 C -0.63 A D C T =70 C -0.5 C Pulsed drain current I T =25 C -2.5 D,pulse C I = -0.63 A, D E 4.0 Avalanche energy, single pulse mJ AS R =25 GS I = -0.63 A, D V =-16 V, DS -6 Reverse diode dv /dt dv /dt kV/s di /dt =-200 A/s, T =150 C j,max Gate source voltage V 12 V GS Power dissipation P T =25 C 0.30 W tot A T , T -55 ... 150 Operating and storage temperature C j stg ESD class JESD22-C101 (HBM) 0 (max 250V) 260 C Soldering temperature IEC climatic category DIN IEC 68-1 55/150/56 Rev. 1.32 page 1 2011-07-13BSS 209PW Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, R - - 120 K/W thJS junction - soldering point minimal footprint R SMD version, device on PCB: - - 420 thJA 2 1) - - 350 6 cm cooling area Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0 V, I =-250A Drain-source breakdown voltage -20 - - V (BR)DSS GS D Gate threshold voltage V V =V , I =3.5 A -0.6 -0.9 -1.2 GS(th) DS GS D V =-20 V, V =0 V, DS GS Zero gate voltage drain current I - -0.1 -1 A DSS T =25 C j V =-20 V, V =0 V, DS GS - -10 -100 T =150 C j I V =12 V, V =0 V Gate-source leakage current - -10 -100 nA GSS GS DS Drain-source on-state resistance R V =2.5 V, I =0.46 A - 581 900 DS(on) GS D V =4.5 V, I =0.63 A - 379 550 GS D V >2 I R , DS D DS(on)max g Transconductance 0.87 1.74 - S fs I =0.46 A D 1) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air t10 sec. Rev. 1.32 page 2 2011-07-13