SPP12N50C3 SPI12N50C3, SPA12N50C3 Cool MOS Power Transistor V T 560 V DS jmax Feature R 0.38 DS(on) New revolutionary high voltage technology I 11.6 A D Ultra low gate charge PG-TO220-3-31 PG-TO262- PG-TO220 Periodic avalanche rated 2 Extreme dv/dt rated 3 Ultra low effective capacitances 2 3 1 2 1 P-TO220-3-31 Improved transconductance P-TO220-3-1 PG-TO-220-3-31 -3-111: Fully isolated package (2500 VAC 1 minute) Type Package Ordering Code Marking 12N50C3 SPP12N50C3 PG-TO220 Q67040-S4579 12N50C3 SPI12N50C3 PG-TO262 Q67040-S4578 12N50C3 SPA12N50C3 PG-TO220FP SP000216322 Maximum Ratings Parameter Symbol Value Unit SPP I SPA Continuous drain current I A D 1) T = 25 C 11.6 11.6 C 1) T = 100 C 7 7 C Pulsed drain current, t limited by T I 34.8 34.8 A p jmax D puls Avalanche energy, single pulse E 340 340 mJ AS I =5.5A, V =50V D DD 2) E Avalanche energy, repetitive t limited by T 0.6 0.6 AR AR jmax I =11.6A, V =50V D DD Avalanche current, repetitive t limited by T I 11.6 11.6 A AR jmax AR Gate source voltageGate source voltage V 20 20 V GS V Gate source voltage AC (f >1Hz) 30 30 GS Power dissipation, T = 25C P 125 33 W C tot Operating and storage temperature T , T -55...+150 C j stg 7) Reverse diode dv/dt dv/dt 15 V/ns Page 1 Rev. 3.1 2009-11-30SPP12N50C3 SPI12N50C3, SPA12N50C3 Maximum Ratings Parameter Symbol Value Unit Drain Source voltage slope dv/dt 50 V/ns V = 400 V, I = 11.6 A, T = 125 C DS D j Thermal Characteristics Parameter Symbol Values Unit min. typ. max. R - - 1 K/W Thermal resistance, junction - case thJC - - 3.8 Thermal resistance, junction - case, FullPAK R thJC FP R - - 62 Thermal resistance, junction - ambient, leaded thJA - - 80 Thermal resistance, junction - ambient, FullPAK R thJA FP SMD version, device on PCB: R thJA min. footprint - - 62 2 3) 6 cm cooling area - 35 - - - 260 C Soldering temperature, wavesoldering T sold 4) 1.6 mm (0.063 in.) from case for 10s Electrical Characteristics, at T =25C unless otherwise specified j Parameter Symbol Conditions Values Unit min. typ. max. V V =0V, I =0.25mA - - V Drain-source breakdown voltage 500 (BR)DSS GS D V =0V, I =11.6A - 600 - Drain-Source avalanche V GS D (BR)DS breakdown voltage I =500A, V =V 2.1 3 3.9 Gate threshold voltage V D GS DS GS(th) V =500V, V =0V, A Zero gate voltage drain current I DS GS DSS T =25C - 0.1 1 j T =150C - - 100 j V =20V, V =0V - - 100 nA Gate-source leakage current I GS DS GSS V =10V, I =7A Drain-source on-state resistance R GS D DS(on) T =25C - 0.34 0.38 j T =150C - 0.92 - j R f=1MHz, open drain - 1.4 - Gate input resistance G Page 2 Rev. 3.1 2009-11-30