SPD50P03L G OptiMOS -P Power-Transistor Product Summary Features V -30 V DS P-Channel R 7 m DS(on),max Enhancement mode I -50 A D Logic level 175C operating temperature Avalanche rated PG-TO252-5 dv /dt rated High current rating Pb-free lead-plating, RoHS compliant Package Marking Tape and reel information Lead Free Packing Type SPD50P03L G PG-TO252-5 50P03L 1000 pcs / reel Yes Non dry Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit 1) Continuous drain current I -50 A T =25 C D C 1) -50 T =100 C C Pulsed drain current I T =25 C -200 D,pulse C E 256 Avalanche energy, single pulse I =-50 A, R =25 mJ AS D GS I =-50 A, V =24 V, D DS Reverse diode dv /dt dv /dt di /dt =-200 A/s, -6 kV/s T =175 C j,max V Gate source voltage 20 V GS P T =25 C 150 Power dissipation W tot C Operating and storage temperature T , T -55+175 C j stg ESD class HBM 1C Soldering temperature 260 55/175/56 IEC climatic category DIN IEC 68-1 Rev. 1.9 page 1 2012-09-13SPD50P03L G Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics R Thermal resistance, junction - case - - 1 K/W thJC R minimal footprint - - 75 thJA Thermal resistance, junction - ambient 2 2) 6 cm cooling area -- 50 Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0 V, I =-250 A Drain-source breakdown voltage -30 - - V (BR)DSS GS D V =V , DS GS Gate threshold voltage V -1 -1.5 -2 GS(th) I =-250 A D V =-30 V, V =0 V, DS GS I Zero gate voltage drain current - -0.1 -1 A DSS T =25 C j V =-30 V, V =0 V, DS GS - -10 -100 T =175 C j Gate-source leakage current I V =-20 V, V =0 V - -10 -100 nA GSS GS DS V =-4.5 V, GS R Drain-source on-state resistance - 8.5 12.5 m DS(on) I =-30 A D R V =-10 V, I =-50 A Drain-source on-state resistance - 5.7 7.0 DS(on) GS D V >2 I R , DS D DS(on)max Transconductance g 47 94 - S fs I =-50 A D 1) Current is limited by bondwire with an R =1 K/W the chip is able to carry 123 A. thJC 2) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.9 page 2 2012-09-13