MA4P7102B-401 MACOM

MA4P MELF & HIPAX Series High Power PIN Diodes V14 Package Styles Features High Power Handling Low Loss / Low Distortion Voltage Ratings up to 1000 Volts Passivated Chip for Low Leakage Current 401 & 402 Low Theta ( ) Due to Full Face Chip Bonding Leadless Low Inductance MELF Packages Various Package Options Available as Chips Fully RoHS Compliant Non-Magnetic Packages Available for MRI 1072 & 1091 Description Applications HIPAX PIN diodes are designed for use in a wide M/A-COM Technology Solutions MELF and HIPAX variety of switch and attenuator applications from HF PIN diode series are designed for usage in switch through UHF frequencies and at power levels above and attenuator applications requiring high power 1kW, CW. The internal chip as well as each diode handling and low distortion. The MELF and HIPAX assembly has been comprehensively tested and PIN diodes incorporate a fully passivated PIN diode characterized to ensure predictable and repeatable chip resulting in an extremely low reverse bias performance. leakage current. The semiconductor technology utilized in the MELF and HIPAX families draws on M/A-COM Techs substantial experience in PIN Design Recommendations diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier Low Distortion Attenuators lifetime while maintaining low series resistance and MA4P4301B capacitance values. The chips of the MELF and Surface Mount Switches HIPAX PIN diodes are enclosed in a rugged MA4P7101F ceramic package and is full face bonded to metal Cellular Radio Antenna Switches pins on both the anode and cathode. The result is a MA4P1200, MA4P1250 low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in either magnetic or non-magnetic, HIPAX (axial leaded) or Metal Electrode Leadless Faced (MELF) Absolute Maximum Ratings 1 surface mount packages for MRI applications. The T = +25C (Unless Otherwise Noted) AMB MELF is a rectangular SMQ, package which is designed for high volume tape and reel assembly. Parameter Absolute Maximum This easy to use package design makes automatic D.C. Reverse Voltage (V ) (See Tables) pick and place, indexing and assembly, extremely R easy. The parallel flat surfaces are suitable for most Operating Chip Junction -55C to +175C key jaw or vacuum pick-up techniques. All of the Temperature solderable surfaces are tin plated and compatible Storage Temperature -55C to +200C with industry standard reflow and vapor phase soldering processes. See page 7 of Application Installation Temperature +280C for 30 Seconds Note M538 on the M/A-COM Technology Solutions website for a typical solder reflow profile. ESD Class 1A, HBM Notes 1. Operation of this device above any one of these parameters may cause permanent damage. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 1 is considering for development. Performance is based on target specifications, simulated results, India Tel: +91.80.4155721 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P MELF & HIPAX Series High Power PIN Diodes V14 MA4P1000 Series Electrical Specifications T = +25C AMB R R V C R T S P Reverse Voltage Total Capacitance Series Resistance Parallel Resistance V pF k DC Part Number Conditions Conditions Conditions Condition (NM Indicates Non-Magnetic) f = 1 MHz f = 100 MHz f = 100 MHz I = 10 A R V = 50 V I = 50 mA V = 0 V R F R MAXIMUM MINIMUM TYPICAL MAXIMUM TYPICAL MAXIMUM MINIMUM RATING MA4P1200 - 401T 50 100 1.2 1.5 0.5 0.75 5 MA4P1200NM - 401T 50 100 1.2 1.5 0.5 0.75 5 MA4P1250 -1072T 50 100 0.8 1.2 0.5 0.75 5 MA4P1250NM -1072T 50 100 0.8 1.2 0.5 0.75 5 MA4P1450 -1091T 50 100 1.8 2.5 0.5 0.75 5 MA4P1450NM -1091T 50 100 1.8 2.5 0.5 0.75 5 T Forward Bias Reverse Bias V L F Forward Voltage Carrier Lifetime Harmonic Distortion Harmonic Distortion (Max. I 1V 1.5A) Forward R(2a/a) * R(3a/a) R(2a/a) R(3a/a) Part Number Condition Conditions Conditions Conditions (NM Indicates Non-Magnetic) I = 50 mA I = 10 mA f = 100 MHz f = 100 MHz F F MAXIMUM TYPICAL MINIMUM TYPICAL MINIMUM TYPICAL MINIMUM TYPICAL RATING MA4P1200 - 401T 0.85 1.0 2 8 80 90 60 70 MA4P1200NM - 401T 0.85 1.0 2 8 80 90 60 70 MA4P1250 -1072T 0.85 1.0 2 8 80 90 60 70 MA4P1250NM -1072T 0.85 1.0 2 8 80 90 60 70 MA4P1450 -1091T 0.85 1.0 2 8 80 90 60 70 MA4P1450NM -1091T 0.85 1.0 2 8 80 90 60 70 *Notes: 1.) NM in the base part number signifies non-magnetic package. 2.) T suffix denotes tape and reel Power Dissipation and Thermal Resistance Ratings T = +25C AMB MA4P1200(NM)-401T MA4P1250(NM)-1072T MA4P1450(NM)-1091T Package CONDITION Style P P P DISS JC DISS JC DISS JC No Heatsink 1.5 W B 15C/W Axial Lead Lead Length 1/4 5.5W No Heatsink 6W 10W F 15C/W 5C/W MELF Infinite Heatsink 18W 30W ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 2 is considering for development. Performance is based on target specifications, simulated results, India Tel: +91.80.4155721 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.