MA4P7452F-1072T Non Magnetic SMQ MELF PIN Diode Rev. V3 Features Non-Magnetic Package Suitable for MRI Applications Rectangular MELF SMQ Ceramic Package 1072 Hermetically Sealed Low Rs for Low Series Loss Long for Lower Intermodulation Distortion L Low C for High Series Isolation j High Average Incident Power Handling RoHS Compliant Description The MA4P7452F-1072T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Designed for Automated Assembly Leadless Faced (MELF) package. The device in- These SMQ PIN diodes are designed for high corporates M/A-COM Technology Solutions time volume tape and reel assembly. The rectangular proven HIPAX technology to produce a low induc- package design provides for highly efficient tance ceramic package with no ribbons or whisker automatic pick and place assembly techniques. The wires. Incorporated in the package is a hard glass parallel flat surfaces are suitable for key jaw or passivated, CERMACHIP PIN chip that is full vacuum pickup. All solderable surfaces are tin plated face bonded on both the cathode and anode to and compatible with reflow and vapor phase solder- maximize surface area for the lowest electrical and ing methods. thermal resistance. The package utilizes a non- magnetic plating process that provides for a pack- age with extremely low permeability. The MA4P7452F-1072T has been comprehensively 1 characterized both electrically and mechanically to Absolute Maximum Ratings 25C ensure repeatable and predictable performance. The non-magnetic MA4P7452F-1072T is the elec- Parameter Absolute Maximum trical equivalent of its magnetic counterpart the Operating Temperature -65 C to +125C MA4P7002F-1072T. Storage Temperature -65 C to +150C Applications Diode Junction Temperature +175 C Continuous This diode is well suited for use in low loss, low distortion, high power switching circuits and can Diode Mounting Temperature +235C for 10 seconds be used in high magnetic field environments at HF RF C.W. Incident Power + 50 dBm C.W. through UHF frequencies. The low thermal resis- tance of this device provides excellent perform- Forward D.C. Current + 250 mA ance at high RF power incident levels, up to 100 watts CW. This device is designed to meet the Reverse D.C. Voltage -10uA l - 150 V l most demanding electrical and mechanical MRI 1. Exceeding these limits may cause permanent damage. environments. 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4P7452F-1072T Non Magnetic SMQ MELF PIN Diode Rev. V3 Electrical Specifications +25 C Parameter Symbol Condition Unit Value Forward Voltage (Maximum) V I = +100 mA 1.0 V F F DC Voltage Rating (Minimum) V Ir = -10 uA l 150 l V R DC Total Capacitance (Maximum) C -100 V 100 MHz 0.7 pF T Series Resistance (Maximum) R +100 mA 100 MHz 0.9 Ohms S Parallel Resistance (Minimum) R -10 V 100 MHz 75 K P +6 mA / -10 mA Carrier Lifetime (Nominal) 9 s L (50% - 90% Voltage) I-Region Length (Nominal) m - 175 m I = 1A, I = 10 mA, H L C.W. Thermal Resistance (Maximum) 15 C/W T = 1 mS Power Dissipation in Free Air (Maximum) W I = +100 mA 4 W F Power Dissipation (Maximum) P I = +100 mA 10 W D F Environmental Capability MELF devices are appropriate for use in industrial and military applications and can be screened to meet the environmental requirements of MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the MIL-STD 750 tests the device is designed to meet. Test Method Description High Temperature Storage 1031 +150C, for 340 Hours Temperature Shock 1051 -65C to +150C, 20 Cycles HTRB 1038 80% of rated V , +150C, for 96 Hours B Moisture Resistance 1021 No Initial Conditioning, 85% RH, +85C Gross Leak 1071 Cond. E Dye Penetrant Visual Vibration Fatigue 2046 20,000Gs, 60Hz, x, y, z axis Solderability 2026 Test Temperature = +245C 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: