MA4SPS502 TM SURMOUNT PIN Diode Rev. V3 1,2 Features Case Style Outline Drawing ODS-1270 Surface Mount Device No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS* Compliant and 260C Reflow Compatible Description and Applications This device is a silicon-glass PIN diode chip fabri- cated with M/A-COM Technology Solutions patented TM HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective back- 1. Backside metal: 0.1 M thick. side metalization is applied producing a surface 2. Hatched areas indicate backside ohmic gold contacts. mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for INCHES MM scratch protection. These protective coatings prevent DIM damage to the junction and the anode air-bridge Min. Max. Min. Max. during handling and assembly. A 0.058 0.062 1.47 1.57 These packageless devices are suitable for usage in B 0.026 0.030 0.66 0.76 moderate incident power (10 W C.W.) or higher C 0.004 0.006 0.10 0.15 incident peak power (500 W) series, shunt, or series- shunt switches. Small parasitic inductance, 0.35 nH, D 0.020 0.022 0.51 0.56 and an excellent RC time constant, 0.22 pS, make these devices ideal for switch applications where E 0.013 0.015 0.33 0.38 higher P and IP3 values are required. These 1dB diodes can also be used in p, T, tapered resistance, and switched-pad attenuator control circuits for 50W Absolute Maximum Ratings T = 25C AMB or 75W systems. Parameter Absolute Maximum Forward Current 600mA Reverse Voltage -275 V Ordering Information Operating Temperature -65C to +125C Tape and Reel Storage Temperature -55 C to +150C Gel Pack (100 pieces) Pocket Tape (3000 pieces) Junction Temperature +175C Dissipated Power 3W MA4SPS502 MADP-000502-12700P ( RF & DC ) * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4SPS502 TM SURMOUNT PIN Diode Rev. V3 Electrical Specifications T = +25C AMB Symbol Conditions Units Min. Typical Max. -40V, 1MHz pF 0.140 0.200 C T -40V, 1GHz pF 0.090 100mA, 100MHz 1.4 2.2 R S 20mA, 100MHz 2.4 3.2 V 10mA V 0.87 1.00 F V 10A V -200 -275 R -200V A -10 I R -40V nA 8 Steady State C/W 50 JL +10mA / -6mA T S 2.8 L ( 50% - 90% V ) When soldering these devices to a hard substrate, hot gas Handling die bonding is preferred. We recommend utilizing a vac- All semiconductor chips should be handled with care uum tip and force of 60 to 100 grams applied to the top to avoid damage or contamination from perspiration surface of the device. When soldering to soft substrates, it and skin oils. The use of plastic tipped tweezers or is recommended to use a Gold-Tin interface at the circuit vacuum pickups is strongly recommended for individ- board mounting pads. Position the device so that its ual components. Bulk handling should ensure that mounting pads are force aligned with the circuit board abrasion and mechanical shock are minimized. mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 Die Attach grams of perpendicular to the top surface of the die. Attachment to a circuit board is made simple through The solder joint must not be made one pad at a time. the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of Doing so could create unequal heat flow and produce thermal and/or mechanical stresses. It is also not recom- these devices and are removed from the active junc- tion locations. These devices are well suited for solder mended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is trans- attachment onto hard and soft substrates. The use of 80/20, Au/Sn or RoHS compliant solders is recom- parent, the edges of the mounting pads can be visually inspected through the die after attach is completed. mended. A conductive silver epoxy may also be used . 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: