MADP-011034-10720T Non-Magnetic MELF PIN Diode Rev V2 Package Style 1072 Features Non-Magnetic Package for MRI Applications Rectangular MELF Ceramic Package Hermetically Sealed RoHS Compliant Description The MADP-011034-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-011034-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed 1,2,3 Absolute Maximum Ratings 25C component that has extremely low electromagnetic permeability. Incorporated in the package is a glass Absolute passivated CERMA chip that is full face bonded on Parameter Maximum the cathode and anode which maximizes the surface 1,2 contact area to minimize the electrical and thermal Reverse DC & AC Voltage -150 V resistances. The chip and package have been 1,2 D.C. Forward Current 0.5 A comprehensively characterized both electrically and mechanically to ensure repeatable and predictable Peak A.C. Forward Surge performance. Current ( 8.3 mS Single 2.5 A 1,2 Half Sine Wave ) Application 1,2,3 C.W. Power Dissipation 6.0 W The MADP-011034-10720T is designed for circuit 1,2 protection and the tuning of RF coil designs in MRI Operating Temperature -65C to +150C applications. When connected in an anti-parallel 1,2 configuration these PIN diodes provide excellent Storage Temperature -65C to +175C protection from long RF pulses and transient voltage 1,2 Mounting Temperature +260C for 30 s spikes. 1. Exceeding these limits may cause permanent damage 2. Values will de-rate over temperature. 3. Infinite Heat Sink, de-rate to 0W +175 C , by 40mW/C from 25C to +175 C Designed for Automated Assembly RoHS This easy to use package design makes automatic The MADP-011034-10720T is fully RoHS compliant pick and place, indexing and assembly, extremely meaning that it contains less than the maximum easy. The parallel flat surfaces are well suited for allowable concentration of 0.1% by weight for lead, most key jaw or vacuum pick-up techniques. All of the PBB, PBDE, and 0.01% of cadmium and hexavalent solderable surfaces are tin plated and compatible with chromium at raw homogeneous materials level. industry standard reflow and vapor phase soldering There is less than 100ppm of mercury and no processes. mercury was intentionally added to the component. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- Visit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-011034-10720T Non-Magnetic MELF PIN Diode Rev V2 Electrical Specifications T = +25C AMB Parameter Units Conditions Min Typ Max -V V -10A -100 -150 B V V 10mA 0.8 0.9 F V V 100mA 0.9 1.0 F V V 1000mA 1.1 1.3 F -I nA Vr = -20V -10 -20 R -I nA Vr = -50V -20 -100 R C pF VR = 0V/ Freq. = 1 MHz 1.0 1.5 T R K VR = 0V/ Freq. = 64 MHz 100 400 P Gp S VR = 0V/ Freq. = 64 MHz 2.5 10 R IF = 10mA / Freq. = 100 MHz 0.4 0.5 S T nS IF = 10mA / IR = -6mA 300 500 L I region Thickness m 11 C.W. Power Dissipation W Infinite Heatsink 6.0 6.0 C.W. Thermal Resistance C/W 25 30 Typical Performance at Ambient = +25C 1.070 700 C vs. Freq. T0V 1.060 600 R vs.Freq. P0V 1.050 500 1.040 400 pF K 1.030 300 1.020 200 1.010 100 1.000 0 MHz MHz ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- Visit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. 50 73 95 118 140 163 185 208 230 253 275 298 320 343 365 388 410 433 455 478 500 50 73 95 118 140 163 185 208 230 253 275 298 320 343 365 388 410 433 455 478 500