X-On Electronics has gained recognition as a prominent supplier of LX5551LQ RF Amplifier across the USA, India, Europe, Australia, and various other global locations. LX5551LQ RF Amplifier are a product manufactured by Microchip. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

LX5551LQ Microchip

LX5551LQ electronic component of Microchip
Images are for reference only
See Product Specifications
Part No.LX5551LQ
Manufacturer: Microchip
Category: RF Amplifier
Description: RF Amplifier LX5551LQ
Datasheet: LX5551LQ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 2.1829
10 : USD 1.7672
100 : USD 1.4137
500 : USD 1.2726
1000 : USD 1.1302
3000 : USD 1.1139
6000 : USD 1.11
9000 : USD 1.0256
24000 : USD 1.008
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Brand
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the LX5551LQ from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LX5551LQ and other electronic components in the RF Amplifier category and beyond.

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WWW.Microsemi .COM LX5551 LX5551 LX5551 2.4-2.5 GHz Front-End Module with Internally TM Matched Power Amplifier & SPDT for 11b/g/n PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES LX5551 is a high-performance The Rx path of LX5551 includes a 2.4-2.5GHz 11b/g/n Front-End WLAN front-end module (FEM) for low-cost SPDT switch with excellent Solution in a Single 3x3mm 802.11b/g/n and other applications in insertion loss and isolation. It features a MLP Package the 2.4-2.5GHz frequency range. very low Tx-to-Rx port leakage in All RF Ports Matched to 50 LX5551 integrates an advanced receive mode. Single-Polarity 3.3V Supply InGaP/GaAs Heterojunction Bipolar LX5551 is available in a 16-pin, Tx Path Power Gain ~ 27dB Transistor (HBT) power amplifier with 3x3mm micro-lead package (MLPQ- Rx Path Loss ~ 0.6dB both input/output impedance matching, 16L). With its best-class performance Pout ~ +18dBm at Antenna* for and an InGaAs pseudomorphic HEMT and compact footprint, LX5551 offers an EVM = 3% (pHEMT) switch, into a single 3x3mm ideal front-end solution for the ever Total Current ~140mA for package. demanding design requirements of +18dBm with 90% Duty Cycle The Tx path of LX5551 features a todays WLAN systems, including Pout > +22dBm for 11b 1Mbps two-stage monolithic microwave 802.11b/g and the latest 11n MIMO DSSS Mask Compliance 2 integrated circuit (MMIC) power implementation. Small Footprint: 3x3mm amplifier with active bias circuitry, and Low Profile: 0.9mm 50 input/output matching inside the RoHS Compliant & Pb-Free * Including SPDT switch loss package. With 3.3V supply voltage and 90mA nominal bias current, the Tx path provides 27dB gain and +18dBm linear output power, with extremely low total EVM (<3%) for 64QAM/54Mbps APPLICATIONS OFDM. Both gain and power are readily measured at antenna port, with IEEE 802.11b/g switch insertion loss included. IEEE 802.11n MIMO IMPORTANT: For the most current data, consult MICROSEMIs website: WWW.Microsemi .COM PACKAGE DATA PACKAGE DATA LX5551 2.4-2.5 GHz Front-End Module with Internally TM Matched Power Amplifier & SPDT for 11b/g/n PRODUCTION DATA SHEET PRODUCT HIGHLIGHT MSMSMSCCC 555155515551 720A720A720A PACKAGE ORDER INFO Plastic MLPQ 16 pin 3x3mm LQ RoHS Compliant /Pb-Free LX5551LQ Note: Available in Tape & Reel. Append the letters TR to the part number. (i.e. LX5551LQ-TR) ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT VcVccc OpenOpen VcVc11 OpenOpen DC Supply Voltage, RF off (PA).......................................................................5V (Switch) ................................................................5V 161616 151515 141414 131313 Collector Current (PA)................................................................................500mA TxITxInn 111 VcVc22 121212 Total Power Dissipation....................................................................................2W 222 VrVreeff 111111 OOpenpen RF Input Power............................................................................................10dbm Maximum Junction Temperature (Tj max) ................................................ +150C DeDett 333 101010 PAPAOOuutt Operation Ambient Temperature ...................................................-40C to +85C RxRxOOuutt 444 SwISwInn 999 Storage Temperature....................................................................-65C to +150C 555 666 777 888 RoHs/Pb Free Peak Package Solder Reflow Temperature (40 seconds maximum exposure)...260C(+0, -5) CCttl1l1 AnAntt Ctl2Ctl2 OOppttiionalonal Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to LQ PACKAGE Ground. Currents are positive into, negative out of specified terminal. (See-Through View from Top) THERMAL DATA RoHS/Pb-free 100% Matte Tin Lead finish Plastic MLPQ 16-Pin LQ THERMAL RESISTANCE-JUNCTION TO CASE, 17C/W JC THERMAL RESISTANCE-JUNCTION TO AMBIENT, 55.2C/W JA Junction Temperature Calculation: T = T + (P x ). J A D JA The numbers are guidelines for the thermal performance of the device/pc-board system. All of the JA above assume no ambient airflow. Copyright 2008 Microsemi Rev. 1.0, 2008-12-17 Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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