256MB, 512MB (x64, DR)
144-PIN SDRAM SODIMM
MT16LSDF3264(L)H 256MB
SMALL-OUTLINE
MT16LSDF6464(L)H 512MB
SDRAM MODULE For the latest data sheet, please refer to the Micron Web
site: www.micron.com/products/modules
Features Figure 1: 144-Pin SODIMM (MO-190)
PC100- and PC133-compliant, 144-pin, small-
PCB height: 1.25in (31.75mm)
outline, dual in-line memory module (SODIMM)
Utilizes 100 MHz and 133 MHz SDRAM components
Unbuffered
256MB (32 Meg x 64) and 512MB (64 Meg x 64)
Single +3.3V power supply
Fully synchronous; all signals registered on positive
edge of system clock
Internal pipelined operation; column address can
be changed every clock cycle
Internal SDRAM banks for hiding row access/
precharge
Programmable burst lengths: 1, 2, 4, 8, or full page
Auto precharge and auto refresh modes
Options Marking
Self refresh mode: standard and low-power
256MB module: 64ms, 4,096-cycle refresh (15.625s
Self refresh current
refresh interval); 512MB: 64ms, 8,192-cycle refresh
Standard None
1
(7.81s refresh interval)
Low power L
LVTTL-compatible inputs and outputs
Package
Serial presence-detect (SPD)
144-pin SODIMM (standard) G
1
Gold edge connectors
144-pin SODIMM (lead-free) Y
Memory Clock/CL
Table 1: Timing Parameters
7.5ns (133 MHz)/CL = 2 -13E
CL = CAS (READ) latency
7.5ns (133 MHz)/CL = 3 -133
10ns (100 MHz)/CL = 2 -10E
ACCESS TIME
PCB
MODULE CLOCK SETUP HOLD
MARKING FREQUENCY CL = 2 CL = 3 TIME TIME
Height 1.25in (31.75mm) See page 2 note
-13E 133 MHz 5.4ns 1.5ns 0.8ns
NOTE: 1. Contact Micron for product availability.
-133 133 MHz 5.4ns 1.5ns 0.8ns
-10E 100 MHz 6ns 2ns 1ns
Table 2: Address Table
256MB 512MB
4K 8K
Refresh count
Device banks 4 (BA0, BA1) 4 (BA0, BA1)
Device configuration 128Mb (16 Meg x 8) 256Mb (32 Meg x 8)
Row addressing 4K (A0A11) 8K (A0A12)
Column addressing 1K (A0A9) 1K (A0A9)
2 (S0#, S1#) 2 (S0#, S1#))
Module ranks
pdf: 09005aef807924d2, source: 09005aef807924f1
SDF16C32_64x64HG.fm - Rev. E 4/06 EN 1 2006 Micron Technology, Inc. All rights reserved.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. 256MB, 512MB (x64, DR)
144-PIN SDRAM SODIMM
Table 3: Part Numbers
SYSTEM
PART NUMBER MODULE DENSITY CONFIGURATION BUS SPEED
256MB 32 Meg x 64 133 MHz
MT16LSDF3264(L)HG-13E_
MT16LSDF3264(L)HY-13E_ 256MB 32 Meg x 64 133 MHz
MT16LSDF3264(L)HG-133_ 256MB 32 Meg x 64 133 MHz
MT16LSDF3264(L)HY-133_ 256MB 32 Meg x 64 133 MHz
256MB 32 Meg x 64 100 MHz
MT16LSDF3264(L)HG-10E_
256MB 32 Meg x 64 100 MHz
MT16LSDF3264(L)HY-10E_
MT16LSDF6464(L)HG-13E_ 512MB 64 Meg x 64 133 MHz
MT16LSDF6464(L)HY-13E_ 512MB 64 Meg x 64 133 MHz
MT16LSDF6464(L)HG-133_ 512MB 64 Meg x 64 133 MHz
512MB 64 Meg x 64 133 MHz
MT16LSDF6464(L)HY-133_
512MB 64 Meg x 64 100 MHz
MT16LSDF6464(L)HG-10E_
MT16LSDF6464(L)HY-10E_ 512MB 64 Meg x 64 100 MHz
NOTE:
1. The designators for component and PCB revision are the last two characters of each part number Consult factory for
current revision codes. Example: MT16LSDF32264(L)HG-133B1.
pdf: 09005aef807924d2, source: 09005aef807924f1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
SDF16C32_64x64HG.fm - Rev. E 4/06 EN 2 2006 Micron Technology, Inc. All rights reserved.