Preliminary
Xccela Flash Memory Data Sheet Brief
Features
Xccela Flash Memory Data Sheet Brief
MT35X 1.8/3V, Octal I/O, 4KB/32KB/128KB Sector Erase
Options Marking
Features
Voltage
SPI-compatible Xccela bus interface
1.72.0V U
Octal DDR protocol
2.73.6V L
Extended-SPI protocol with octal commands
Density
Single and double transfer rate (SDR/DDR)
256Mb 256
Clock frequency:
512Mb 512
166 MHz (MAX) in SDR (166 MB/s) (1.8V)
1Gb 01G
200 MHz (MAX) in DDR (400 MB/s) with DQS
2Gb 02G
(1.8V)
Device stacking
133 MHz (MAX) in SDR (133 MB/s) (3.0V)
Monolithic A
133 MHz (MAX) in DDR (266MB/s) with DQS
2 die stacked B
(3.0V)
4 die stacked C
Execute-in-place (XIP)
Device Generation B
PROGRAM/ERASE SUSPEND operations
Die revision A
Volatile and nonvolatile configuration settings
Configuration
Software reset
Boot in SDR x1 1
Reset pin available
Boot in DDR x8 2
3-byte and 4-byte address modes enable memory
Sector Size
access beyond 128Mb
128KB G
Dedicated 64-byte OTP area outside main memory
Packages: JEDEC-standard, RoHS-com-
Readable and user-lockable
pliant
Permanent lock with PROGRAM OTP command
24-ball T-PBGA 05/6mm x 8mm 12
Erase capability
(5 x 5 array)
Bulk erase for monolithic, die erase for stacked
Security features
devices
Standard security 0
Sector erase 128KB uniform granularity
Special options
Subsector erase 4KB, 32KB granularity
Standard S
Security and write protection
Automotive A
Volatile and nonvolatile locking and software
Operating temperature range
write protection for each 128KB sector
From 40C to +85C IT
Nonvolatile configuration locking and password
From 40C to +105C AT
protection
From 40C to +125C UT
Protection management register offering en-
hanced security features
Hardware write protection: nonvolatile bits
(BP[3:0] and TB) define protected area size
Program/erase protection during power-up
CRC detects accidental changes to raw data
Electronic signature
JEDEC-standard 3-byte signature
Extended device ID: two additional bytes identify
device factory options
JESD47I-compliant
Minimum 100,000 ERASE cycles per sector
Data retention: 20 years (TYP)
CCMTD-1718347970-10442 Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
Xccela_summary Rev. A 04/18 2018 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Microns production data sheet specifications.Preliminary
Xccela Flash Memory Data Sheet Brief
Features
Part Number Ordering
Micron Xccela flash devices are available in different configurations and densities. Verify valid part numbers by
using Microns part catalog search at www.micron.com. To compare features and specifications by device type,
visit www.micron.com/products. Contact the factory for devices not found.
Figure 1: Part Number Ordering Information
-
MT 35X L xxx A B A 1 G 12 0 S IT ES
Micron Technology
Production Status
Blank = Production
Part Family
ES = Engineering samples
35X = Xccela flash memory
QS = Qualification samples
Voltage
Operating Temperature
L = 2.73.6V
IT = 40C to +85C
U = 1.72.0V
AT = 40C to +105C
UT = 40C to +125C
Density
256 = 256Mb
Special Options
512 = 512Mb
S = Standard
01G = 1Gb
A = Automotive grade AEC-Q100
02G = 2Gb
Security Features
Stack
0 = Standard default security
A = 1 die/1 S#
B = 2 die/1 S#
Package Codes
C = 4 die/1 S#
12 = 24-ball T-PBGA, 05/6 x 8mm (5 x 5 array)
Device Generation
Sector Size
B = 2nd generation
G = Uniform 128KB
Die Revision
I/O Pin Configuration Option
A = Rev. A
1 = Boot in SDR x1
2 = Boot in DDR x8
CCMTD-1718347970-10442 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
Xccela_summary Rev. A 04/18 2018 Micron Technology, Inc. All rights reserved.