MT49H32M18BM-33:B Micron

576Mb: x9 x18 x36 CIO RLDRAM 2 Features CIO RLDRAM 2 MT49H64M9 64 Meg x 9 x 8 Banks MT49H32M18 32 Meg x 18 x 8 Banks MT49H16M36 16 Meg x 36 x 8 Banks 1 Options Marking Features Clock cycle timing 533 MHz DDR operation (1.067 Gb/s/pin data rate) t 1.875ns RC = 15ns -18 t 38.4 Gb/s peak bandwidth (x36 at 533 MHz clock 2.5ns RC = 15ns -25E t frequency) 2.5ns RC = 20ns -25 t Organization 3.3ns RC = 20ns -33 64 Meg x 9, 32 Meg x 18, and 16 Meg x 36 I/O Configuration 8 banks 64 Meg x 9 64M9 32 Meg x 18 32M18 Reduced cycle time (15ns at 533 MHz) 16 Meg x 36 16M36 Nonmultiplexed addresses (address multiplexing Operating temperature option available) Commercial (0 to +95C) None SRAM-type interface Industrial (T = 40C to +95C IT C Programmable READ latency (RL), row cycle time, T = 40C to +85C) A and burst sequence length Package Balanced READ and WRITE latencies in order to op- 144-ball BGA FM timize data bus utilization 144-ball BGA (Pb-free) BM Data mask for WRITE commands 144-ball FBGA TR 144-ball FBGA (Pb-free) SJ Differential input clocks (CK, CK ) Revision :A/:B Differential input data clocks (DKx, DKx ) 1. Not all options listed can be combined to On-die DLL generates CK edge-aligned data and Note: define an offered product. Use the part cat- output data clock signals alog search on www.micron.com for availa- Data valid signal (QVLD) ble offerings. 32ms refresh (16K refresh for each bank 128K re- fresh command must be issued in total each 32ms) HSTL I/O (1.5V or 1.8V nominal) matched impedance outputs 2.5V V , 1.8V V , 1.5V or 1.8V V I/O EXT DD DDQ On-die termination (ODT) R TT PDF: 09005aef80fe62fb Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 576Mb RLDRAM 2 CIO D1.pdf - Rev. M 09/15 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.576Mb: x9 x18 x36 CIO RLDRAM 2 Features BGA Marking Decoder Due to space limitations, BGA-packaged components have an abbreviated part marking that is different from the part number. Microns BGA Part Marking Decoder is available on Microns web site at micron.com. Figure 1: Part Numbers Example Part Number: MT49H16M36SJ-25 :B -: MT49H Configuration I/O Package Speed Temp. Rev. Configuration I/O Revision 64 Meg x 9 64M9 Common None :A Rev. A 32M18 32 Meg x 18 Separate C :B Rev. B 16 Meg x 36 16M36 Temperature Package Commercial None FM 144-ball BGA IT Industrial BM 144-ball BGA (Pb-free) Speed Grade TR 144-ball FBGA t -18 CK = 1.875ns SJ 144-ball FBGA (Pb-free) t -25E CK = 2.5ns t -25 CK = 2.5ns t -33 CK = 3.3ns PDF: 09005aef80fe62fb Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 576Mb RLDRAM 2 CIO D1.pdf - Rev. M 09/15 2015 Micron Technology, Inc. All rights reserved.