MT49H32M9SJ-25:B Micron

288Mb: x9, x18, x36 CIO RLDRAM 2 Features CIO RLDRAM 2 MT49H32M9 32 Meg x 9 x 8 Banks MT49H16M18 16 Meg x 18 x 8 Banks MT49H8M36 8 Meg x 36 x 8 Banks 1 Options Marking Features Clock cycle timing 533 MHz DDR operation (1.067 Gb/s/pin data rate) t 1.875ns RC = 15ns -18 38.4 Gb/s peak bandwidth (x36 at 533 MHz clock t 2.5ns RC = 15ns -25E frequency) t 2.5ns RC = 20ns -25 Organization t 3.3ns RC = 20ns -33 32 Meg x 9, 16 Meg x 18, and 8 Meg x 36 t 5.0ns RC = 20ns -5 8 internal banks for concurrent operation and maxi- Configuration mum bandwidth 32 Meg x 9 32M9 Reduced cycle time (15ns at 533 MHz) 16 Meg x 18 16M18 Nonmultiplexed addresses (address multiplexing 8 Meg x 36 8M36 option available) Operating temperature SRAM-type interface Commercial (0 to +95C) None Programmable READ latency (RL), row cycle time, Industrial (T = 40C to +95C IT C and burst sequence length T = 40C to +85C) A Balanced READ and WRITE latencies in order to Package optimize data bus utilization 144-ball BGA FM Data mask for WRITE commands 144-ball BGA (Pb-free) BM Differential input clocks (CK, CK ) 144-ball FBGA TR Differential input data clocks (DKx, DKx ) 144-ball FBGA (Pb-free) SJ On-die DLL generates CK edge-aligned data and Revision :B output data clock signals Data valid signal (QVLD) 1. Not all options listed can be combined to Note: 32ms refresh (8K refresh for each bank 64K refresh define an offered product. Use the part cat- command must be issued in total each 32ms) alog search on micron.com for available of- HSTL I/O (1.5V or 1.8V nominal) ferings. 2560 matched impedance outputs 2.5V V , 1.8V V , 1.5V or 1.8V V I/O EXT DD DDQ On-die termination (ODT) R TT PDF: 09005aef80a41b46 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 rldram-2 cio 288mb.pdf - Rev. Q 10/15 EN 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.288Mb: x9, x18, x36 CIO RLDRAM 2 Features BGA Marking Decoder Due to space limitations, BGA-packaged components have an abbreviated part marking that is different from the part number. Microns BGA Part Marking Decoder is available on Microns web site at micron.com. Figure 1: 288Mb RLDRAM 2 CIO Part Numbers Example Part Number: MT49H16M18SJ-25 :B - : MT49H Configuration I/O Package Speed Temp Rev. Revision I/O Rev. A None Common None Configuration Rev. B :B Separate C 32 Meg x 9 32M9 16 Meg x 18 16M18 Temperature 8M36 8 Meg x 36 None Commercial IT Industrial Package 144-ball BGA FM Speed Grade -18 t 144-ball BGA (Pb-free) BM CK = 1.875ns t 144-ball FBGA TR -25E CK = 2.5ns t 144-ball FBGA (Pb-free) SJ -25 CK = 2.5ns t -33 CK = 3.3ns t -5 CK = 5ns PDF: 09005aef80a41b46 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 rldram-2 cio 288mb.pdf - Rev. Q 10/15 EN 2015 Micron Technology, Inc. All rights reserved.