256MB (x64, SR), 512MB (x64, DR) 168-Pin SDRAM UDIMM
Features
Synchronous DRAM Module
MT8LSDT3264A(I) - 256MB
MT16LSDT6464A(I) - 512MB
For the latest data sheet, please refer to the Micron Web site: www.micron.com/products/modules
Figure 1: 168-Pin DIMM (MO161)
Features
PC100- and PC133-compliant
Low Profile 1.125in. (28.575mm)
168-pin, dual in-line memory module (DIMM)
Utilizes 125 MHz and 133 MHz SDRAM
components
Unbuffered
256MB (32 Meg x 64), 512MB (64 Meg x 64)
Single +3.3V 0.3V power supply
Fully synchronous; all signals registered on positive
edge of system clock
Options Marking
Internal pipelined operation; column address can
Package
be changed every clock cycle
168-pin DIMM (standard) G
Internal SDRAM banks for hiding row access/ 1
168-pin DIMM (lead-free) Y
precharge
Operating Temperature Range
Programmable burst lengths: 1, 2, 4, 8, or full page
Commercial (0C to +70C) None
Auto Precharge, including Concurrent Auto 1, 2
Industrial (-40C to +85C) I
Precharge, and Auto Refresh Modes
Memory Clock/CAS Latency
64ms, 8,192 cycle Auto Refresh cycle
(133 MHz)/CL = 2 -13E
Self Refresh Mode
(133 MHz)/CL = 3 -133
LVTTL-compatible inputs and outputs 1
(100 MHz)/CL = 2 -10E
Serial Presence-Detect (SPD)
PCB
Gold edge contacts
Low profile 1.125in. (28.575mm) See page 2 note
Table 1: Timing Parameters
Notes: 1. Consult Micron for product availability.
2. Industrial Temperature Option available in -
Access Time
Module Clock Setup Hold 133 speed only.
Marking Frequency CL = 2 CL = 3 Time Time
-13E 133 MHz 5.4ns 1.5 0.8
-133 133 MHz 5.4ns 1.5 0.8
-10E 100 MHz 9ns 7.5ns 2ns 1ns
Table 2: Address Table
256MB 512MB
Refresh Count 8K 8K
Device Banks 4 (BA0, BA1) 4 (BA0, BA1)
Device Configuration 256Mb (32 Meg x 8) 256Mb (32 Meg x 8)
Row Addressing 8K (A0A12) 8K (A0A12)
1K (A0A9) 1K (A0A9)
Column Addressing
Module Ranks 1 (S0,S2) 2 (S0,S2; S1,S3)
PDF: 09005aef807b3771/Source: 09005aef807b37b5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
SD8_16C32_64x64AG.fm - Rev. D 3/05 EN 1 2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice. 256MB (x64, SR), 512MB (x64, DR) 168-Pin SDRAM UDIMM
Pin Assignments and Descriptions
Table 3: Part Numbers
Part Number Module Density Configuration System Bus Speed
MT8LSDT3264AG-13E_ 256MB 32 Meg x 64 133 MHz
MT8LSDT3264AY-13E_ 256MB 32 Meg x 64 133 MHz
MT8LSDT3264A(I))G-133_ 256MB 32 Meg x 64 133 MHz
MT8LSDT3264A(I)Y-133_ 256MB 32 Meg x 64 133 MHz
MT8LSDT3264AG-10E_ 256MB 32 Meg x 64 100 MHz
MT8LSDT3264AY-10E_ 256MB 32 Meg x 64 100 MHz
MT16LSDT6464AAG-13E_ 512MB 64 Meg x 64 133 MHz
MT16LSDT6464AY-13E_ 512MB 64 Meg x 64 133 MHz
MT16LSDT6464A(I)G-133_ 512MB 64 Meg x 64 133 MHz
MT16LSDT6464A(I)Y-133_ 512MB 64 Meg x 64 133 MHz
MT16LSDT6464AG-10E_ 512MB 64 Meg x 64 100 MHz
MT16LSDT6464AY-10E_ 512MB 64 Meg x 64 100 MHz
Note: The designators for component and PCB revision are the last two characters of each part
number. Consult factory for current revision codes. Example: MT8LSDT3264AG-133D2.
Pin Assignments and Descriptions
Table 4: Pin Assignment (168-Pin DIMM Front)
Pin Symbol Pin Symbol Pin Symbol Pin Symbol
1VSS 22 NC 43 VSS 64 VSS
2DQ0 23 VSS 44 NC 65 DQ21
3DQ1 24 NC 45 S2# 66 DQ22
4DQ2 25 NC 46 DQMB2 67 DQ23
5DQ3 26 VDD 47 DQMB3 68 VSS
6VDD 27 WE# 48 NC 69 DQ24
7DQ4 28 DQMB0 49 VDD 70 DQ25
8DQ5 29 DQMB1 50 NC 71 DQ26
9DQ6 30 S0# 51 NC 72 DQ27
10 DQ7 31 NC 52 NC 73 VDD
11 DQ8 32 VSS 53 NC 74 DQ28
12 VSS 33 A0 54 VSS 75 DQ29
13 DQ9 34 A2 55 DQ16 76 DQ30
14 DQ10 35 A4 56 DQ17 77 DQ31
15 DQ11 36 A6 57 DQ18 78 VSS
16 DQ12 37 A8 58 DQ19 79 CK2
17 DQ13 38 A10 59 VDD 80 NC
18 VDD 39 BA1 60 DQ20 81 NC
19 DQ14 40 VDD 61 NC 82 SDA
20 DQ15 41 VDD 62 NC 83 SCL
21 NC 42 CK0 63 CKE1 84 VDD
PDF: 09005aef807b3771/Source: 09005aef807b37b5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
SD8_16C32_64x64AG.fm - Rev. D 3/05 EN 2 2003 Micron Technology, Inc. All rights reserved.