BAP50-02,115 NXP

BAP50-02 General purpose PIN diode Rev. 3 26 November 2018 Product data sheet 1 Product profile 1.1 General description General-purpose PIN diode in an SOD523 small SMD plastic package. 1.2 Features and benefits Low diode capacitance Low diode forward resistance 1.3 Applications General RF applicationsNXP Semiconductors BAP50-02 General purpose PIN diode 2 Pinning information Table 1.Discrete pinning Pin Description Simplified outline Graphic symbol 1 cathode 2 anode 1 2 sym006 Top view 3 Ordering information Table 2.Ordering information Type number Package Name Description Version BAP50-02 - plastic surface-mounted package 2 leads SOD523 4 Marking Table 3.Marking code Type number Marking code BAP50-02 K4 5 Limiting values Table 4.Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V continuous forward - 50 V R voltage I continuous forward - 50 mA F current P total power dissipation T 90 C - 715 mW tot sp T storage temperature -65 +150 C stg T junction temperature -65 +150 C j 6 Thermal characteristics Table 5.Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to 85 K/W th(j-sp) solder point BAP50-02 All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. Product data sheet Rev. 3 26 November 2018 2 / 9