BGU8004 8 * % SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass Rev. 1 31 January 2014 Preliminary data sheet 1. Product profile 1.1 General description The BGU8004 is a Low Noise Amplifier (LNA) for GNSS receiver applications. It comes as extremely small and thin Wafer Level Chip Scale Package (WLCSP). The BGU8004 requires one external matching inductor. The BGU8004 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimized performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 17 dB gain at a noise figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. 1.2 Features and benefits Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure (NF) = 0.60 dB Gain 17.0 dB High input 1 dB compression point of 7.5 dBm High out of band IP3 of 6 dBm i Supply voltage 1.5 V to 3.1 V Optimized performance at very low 3.4 mA supply current Power-down mode current consumption < 1 A Integrated temperature stabilized bias for easy design Requires only one input matching inductor Input and output DC decoupled ESD protection on all pins (HBM > 2 kV) Integrated matching for the output Extremely small Wafer Level Chip Scale Package (WLCSP) 0.65 0.44 0.2 mm 6 solder bumps 0.22 mm bump pitch 180 GHz transit frequency - SiGe:C technology 1.3 Applications LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature phones, tablet, digital still cameras, digital video cameras, RF front-end modules, complete GNSS modules and personal health applications.BGU8004 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 1.4 Quick reference data Table 1. Quick reference data f = 1575 MHz V = 1.8 V V 0.8 V P < 40 dBm T =25 C input matched to 50 using a 5.6 nH inductor, CC I(ENABLE) i amb see Figure 1 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 1.5 - 3.1 V CC I supply current P < 40 dBm - 3.4 - mA CC i P = 20 dBm - 7.5 - mA i G power gain no jammer - 17.0 - dB p P = 20 dBm f = 1850 MHz - 19.0 - dB i jam 1 NF noise figure no jammer -0.60- dB 2 no jammer -0.65- dB P input power at 1 dB gain compression V =1.8 V - 10 - dBm i(1dB) CC V =2.85V - 7.5 - CC 3 IP3 input third-order intercept point V =1.8 V -4 - dBm i CC 3 V =2.85V -6 - dBm CC 1 PCB losses are subtracted. 2 Including PCB losses. 3 f = 1713 MHz f = 1851 MHz P = 20 dBm at f P = 65 dBm at f . 1 2 i 1 i 2 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1GND RF 2RF IN 3 ENABLE 4GND 5V DDD CC 6RF OUT Bump side view 3. Ordering information Table 3. Ordering information Type Package number Name Description Version BGU8004 WLCSP6 wafer level chip-size package 6 balls BGU8004 body 0.65 0.44 0.29 mm BGU8004 All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Preliminary data sheet Rev. 1 31 January 2014 2 of 18