BTA201W-600E,115 NXP

BTA201W-600E 3Q Hi-Com Triac 13 August 2014 Product data sheet 1. General description Planar passivated high commutation triac in a SOT223 surface mounted plastic package. Thisseries triac balances the requirements of commutation performance and gate sensitivity and is intended for interfacing with low power drivers and logic ICs including microcontrollers. 2. Features and benefits 3Q technology for improved noise immunity Direct triggering from low power drivers and logic ICs High commutation capability with sensitive gate High immunity to false turn-on by dV/dt High voltage capability Planar passivated for voltage ruggedness and reliability Sensitive gate for easy logic level triggering Surface mountable package Triggering in three quadrants only 3. Applications General purpose motor control Small loads in washing machines Solenoid drivers 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V repetitive peak off- - - 600 V DRM state voltage I non-repetitive peak on- full sine wave T = 25 C - - 12.5 A TSM j(init) state current t = 20 ms Fig. 4 Fig. 5 p I RMS on-state current full sine wave T 106 C Fig. 1 - - 1 A T(RMS) sp Fig. 2 Fig. 3 Static characteristics I gate trigger current V = 12 V I = 0.1 A T2+ G+ 1 - 10 mA GT D T T = 25 C Fig. 9 j Scan or click this QR code to view the latest information for this product SOT223NXP Semiconductors BTA201W-600E 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit V = 12 V I = 0.1 A T2+ G- 1 - 10 mA D T T = 25 C Fig. 9 j V = 12 V I = 0.1 A T2- G- 1 - 10 mA D T T = 25 C Fig. 9 j 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 T1 main terminal 1 4 T2 T1 G 2 T2 main terminal 2 sym051 3 G gate 1 2 3 4 T2 main terminal 2 SC-73 (SOT223) 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BTA201W-600E SC-73 plastic surface-mounted package with increased heatsink 4 SOT223 leads BTA201W-600E All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2014. All rights reserved Product data sheet 13 August 2014 2 / 15