X-On Electronics has gained recognition as a prominent supplier of DSP56303AG100R2 Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. DSP56303AG100R2 Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

DSP56303AG100R2 NXP

DSP56303AG100R2 electronic component of NXP
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Part No.DSP56303AG100R2
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP
Datasheet: DSP56303AG100R2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
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MOQ : 1
Multiples : 1
1 : USD 52.8696
5 : USD 52.5924
10 : USD 49.329
25 : USD 47.6658
100 : USD 45.8514
250 : USD 45.171
N/A

Obsolete
   
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We are delighted to provide the DSP56303AG100R2 from our Digital Signal Processors & Controllers - DSP, DSC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DSP56303AG100R2 and other electronic components in the Digital Signal Processors & Controllers - DSP, DSC category and beyond.

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DSP56303 Freescale Semiconductor Rev. 11, 2/2005 Technical Data DSP56303 24-Bit Digital Signal Processor 16 6 6 3 Memory Expansion Area The DSP56303 is intended for use in telecommunication Triple X Data Y Data PrograM HI08 ESSI SCI Timer RAM RAM RAM applications, such as multi- 2048 24 2048 24 4096 24 line voice/data/ fax bits bits bits (default) (default) (default) processing, video Peripheral conferencing, audio Expansion Area applications, control, and YAB 18 Address External XAB general digital signal Generation Address Unit PAB Bus Address processing. Switch Six-Channel DAB DMA Unit External 24-Bit Bus 13 Interface Bootstrap DSP56300 and Inst. ROM Control Core Cache Control DDB YDB 24 Internal External XDB Whats New Data Bus Data PDB Data Bus Switch Rev. 11 includes the following Switch GDB changes: Adds lead-free packaging and EXTAL Power Management Clock part numbers. Data ALU 5 Generator Program Program Program + 24 24 56 56-bit MAC JTAG XTAL Interrupt Decode Address Two 56-bit Accumulators PLL Controller Controller Generator OnCE 56-bit Barrel Shifter DE 2 MODA/IRQA MODB/IRQB RESET MODC/IRQC PINIT/NMI MODD/IRQD Figure 1. DSP56303 Block Diagram The DSP56303 is a member of the DSP56300 core family of programmable CMOS DSPs. Significant architectural features of the DSP56300 core family include a barrel shifter, 24-bit addressing, instruction cache, and DMA. The DSP56303 offers 100 MMACS using an internal 100 MHz clock at 3.03.6 volts. The DSP56300 core family offers a rich instruction set and low power dissipation, as well as increasing levels of speed and power to enable wireless, telecommunications, and multimedia products. Freescale Semiconductor, Inc., 1996, 2005. All rights reserved. PIO EB PM EB XM EB YM EBTable of Contents Data Sheet Conventions.......................................................................................................................................ii Features...............................................................................................................................................................iii Target Applications .............................................................................................................................................iv Product Documentation ......................................................................................................................................iv Chapter 1 Signals/Connections 1.1 Power ................................................................................................................................................................1-3 1.2 Ground ..............................................................................................................................................................1-3 1.3 Clock.................................................................................................................................................................1-4 1.5 External Memory Expansion Port (Port A) ......................................................................................................1-4 1.6 Interrupt and Mode Control ..............................................................................................................................1-7 1.7 Host Interface (HI08)........................................................................................................................................1-8 1.8 Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-11 1.9 Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-12 1.10 Serial Communication Interface (SCI) ...........................................................................................................1-14 1.11 Timers .............................................................................................................................................................1-15 1.12 JTAG and OnCE Interface ..............................................................................................................................1-16 Chapter 2 Specifications 2.1 Maximum Ratings.............................................................................................................................................2-1 2.3 Thermal Characteristics ....................................................................................................................................2-2 2.4 DC Electrical Characteristics............................................................................................................................2-2 2.5 AC Electrical Characteristics............................................................................................................................2-3 Chapter 3 Packaging 3.1 TQFP Package Description...............................................................................................................................3-2 3.2 TQFP Package Mechanical Drawing................................................................................................................3-9 3.3 MAP-BGA Package Description ....................................................................................................................3-10 3.4 MAP-BGA Package Mechanical Drawing .....................................................................................................3-18 Chapter 4 Design Considerations 4.1 Thermal Design Considerations........................................................................................................................4-1 4.2 Electrical Design Considerations......................................................................................................................4-2 4.3 Power Consumption Considerations.................................................................................................................4-3 4.4 PLL Performance Issues ...................................................................................................................................4-4 4.5 Input (EXTAL) Jitter Requirements .................................................................................................................4-5 Appendix A Power Consumption Benchmark Data Sheet Conventions OVERBAR Indicates a signal that is active when pulled low (For example, the RESET pin is active when low.) asserted Means that a high true (active high) signal is high or that a low true (active low) signal is low deasserted Means that a high true (active high) signal is low or that a low true (active low) signal is high Examples: Signal/Symbol Logic State Signal State Voltage PIN V /V True Asserted IL OL PIN V /V False Deasserted IH OH PIN V /V True Asserted IH OH PIN V /V False Deasserted IL OL Note: Values for V , V , V , and V are defined by individual product specifications. IL OL IH OH DSP56303 Technical Data, Rev. 11 ii Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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