MK12DX256VLF5 NXP

Document Number: K12P48M50SF4 Freescale Semiconductor Rev. 4, 08/2013 Data Sheet: Technical Data K12P48M50SF4 K12 Sub-Family Supports the following: MK12DX128VLF5, MK12DX256VLF5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Human-machine interface Performance General-purpose input/output Up to 50 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per 16-bit SAR ADC MHz Two analog comparators (CMP) containing a 6-bit Memories and memory interfaces DAC and programmable reference input Up to 256 KB program flash for devices with Voltage reference FlexNVM. Timers 64 KB FlexNVM on FlexMemory devices Programmable delay block 4 KB FlexRAM on FlexMemory devices Eight-channel motor control/general purpose/PWM Up to 64 KB RAM timer Serial programming interface (EzPort) Two 2-channel general purpose timers, one with Clocks quadrature decoder functionality 3 to 32 MHz crystal oscillator Periodic interrupt timers 32 kHz crystal oscillator 16-bit low-power timer Multi-purpose clock generator Carrier modulator transmitter Real-time clock System peripherals Multiple low-power modes to provide power Communication interfaces optimization based on application requirements USB Device Charger detect 16-channel DMA controller, supporting up to 63 SPI module request sources I2C module External watchdog monitor Four UART modules Software watchdog I2S module Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.3.2 General switching specifications...........................20 1.1 Determining valid orderable parts......................................3 5.4 Thermal specifications.......................................................20 2 Part identification......................................................................3 5.4.1 Thermal operating requirements...........................21 2.1 Description.........................................................................3 5.4.2 Thermal attributes.................................................21 2.2 Format...............................................................................3 6 Peripheral operating requirements and behaviors....................22 2.3 Fields.................................................................................3 6.1 Core modules....................................................................22 2.4 Example............................................................................4 6.1.1 JTAG electricals....................................................22 2.5 Small package marking.....................................................4 6.2 System modules................................................................25 3 Terminology and guidelines......................................................5 6.3 Clock modules...................................................................25 3.1 Definition: Operating requirement......................................5 6.3.1 MCG specifications...............................................25 3.2 Definition: Operating behavior...........................................5 6.3.2 Oscillator electrical specifications.........................27 3.3 Definition: Attribute............................................................6 6.3.3 32 kHz oscillator electrical characteristics.............29 3.4 Definition: Rating...............................................................6 6.4 Memories and memory interfaces.....................................30 3.5 Result of exceeding a rating..............................................7 6.4.1 Flash electrical specifications................................30 3.6 Relationship between ratings and operating 6.4.2 EzPort switching specifications.............................33 requirements......................................................................7 6.5 Security and integrity modules..........................................34 3.7 Guidelines for ratings and operating requirements............8 6.6 Analog...............................................................................34 3.8 Definition: Typical value.....................................................8 6.6.1 ADC electrical specifications.................................34 3.9 Typical value conditions....................................................9 6.6.2 CMP and 6-bit DAC electrical specifications.........38 4 Ratings......................................................................................9 6.6.3 Voltage reference electrical specifications............41 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................42 4.2 Moisture handling ratings..................................................10 6.8 Communication interfaces.................................................42 4.3 ESD handling ratings.........................................................10 6.8.1 DSPI switching specifications (limited voltage 4.4 Voltage and current operating ratings...............................10 range)....................................................................42 5 General.....................................................................................10 6.8.2 DSPI switching specifications (full voltage range).44 5.1 AC electrical characteristics..............................................11 6.8.3 I2C switching specifications..................................46 5.2 Nonswitching electrical specifications...............................11 6.8.4 UART switching specifications..............................46 5.2.1 Voltage and current operating requirements.........11 6.8.5 Normal Run, Wait and Stop mode performance 5.2.2 LVD and POR operating requirements.................12 over the full operating voltage range.....................46 5.2.3 Voltage and current operating behaviors..............13 6.8.6 VLPR, VLPW, and VLPS mode performance 5.2.4 Power mode transition operating behaviors..........13 over the full operating voltage range.....................48 5.2.5 Power consumption operating behaviors..............14 7 Dimensions...............................................................................50 5.2.6 EMC radiated emissions operating behaviors.......18 7.1 Obtaining package dimensions.........................................50 5.2.7 Designing with radiated emissions in mind...........19 8 Pinout........................................................................................50 5.2.8 Capacitance attributes..........................................19 8.1 K12 Signal Multiplexing and Pin Assignments..................50 5.3 Switching specifications.....................................................19 8.2 K12 Pinouts.......................................................................53 5.3.1 Device clock specifications...................................19 9 Revision History........................................................................54 K12 Sub-Family Data Sheet, Rev. 4, 08/2013. 2 Freescale Semiconductor, Inc.