X-On Electronics has gained recognition as a prominent supplier of MSC8152TAG1000B Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. MSC8152TAG1000B Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

MSC8152TAG1000B NXP

MSC8152TAG1000B electronic component of NXP
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Part No.MSC8152TAG1000B
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processor
Datasheet: MSC8152TAG1000B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
15: USD 194.6063 ea
Line Total: USD 2919.09 
Availability - 0
MOQ: 15  Multiples: 15
Pack Size: 15
   
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We are delighted to provide the MSC8152TAG1000B from our Digital Signal Processors & Controllers - DSP, DSC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MSC8152TAG1000B and other electronic components in the Digital Signal Processors & Controllers - DSP, DSC category and beyond.

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Freescale Semiconductor Document Number: MSC8152 Rev. 6, 08/2013 Data Sheet MSC8152 FC-PBGA783 29 mm 29 mm Dual-Core Digital Signal Processor Two StarCore SC3850 DSP subsystems, each with an SC3850 High-speed serial interface that supports two Serial RapidIO DSP core, 32 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, interfaces, one PCI Express interface, and two SGMII interfaces unified 512 Kbyte L2 cache configurable as M2 memory in (multiplexed). The Serial RapidIO interfaces support 1x/4x 64 Kbyte increments, memory management unit (MMU), operation up to 3.125 Gbaud with a single messaging unit and two extended programmable interrupt controller (EPIC), two DMA units. The PCI Express controller supports 32- and 64-bit general-purpose 32-bit timers, debug and profiling support, addressing, x4, x2, and x1 link. low-power Wait, Stop, and power-down processing modes, and QUICC Engine technology subsystem with dual RISC ECC/EDC support. processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction Chip-level arbitration and switching system (CLASS) that RAM, supporting two communication controllers for two Gigabit provides full fabric non-blocking arbitration between the cores Ethernet interfaces (RGMII or SGMII), to offload scheduling and other initiators and the M2 memory, shared M3 memory, tasks from the DSP cores, and an SPI. DDR SRAM controllers, device configuration control and status I/O Interrupt Concentrator consolidates all chip maskable registers, MAPLE-B, and other targets. interrupt and non-maskable interrupt sources and routes then to 1056 Kbyte 128-bit wide M3 memory, 1024 Kbytes of which can INT OUT, NMI OUT, and the cores. be turned off to save power. UART that permits full-duplex operation with a bit rate of up to 96 Kbyte boot ROM. 6.25 Mbps. Three input clocks (one global and two differential). Two general-purpose 32-bit timers for RTOS support per SC3850 Five PLLs (three global and two Serial RapidIO PLLs). core, four timer modules with four 16-bit fully programmable Multi-Accelerator Platform Engine for Baseband (MAPLE-B) timers, and eight software watchdog timers (SWT). with a programmable system interface, Turbo decoding, Viterbi Eight programmable hardware semaphores. decoding, and FFT/iFFT and DFT/iDFT processing. MAPLE-B Up to 32 virtual interrupts and a virtual NMI asserted by simple can be disabled when not required to reduce overall power write access. 2 consumption. I C interface. Two DDR controllers with up to a 400 MHz clock (800 MHz data Up to 32 GPIO ports, sixteen of which can be configured as rate), 64/32 bit data bus, supporting up to a total 2 Gbyte in up to external interrupts. four banks (two per controller) and support for DDR2 and DDR3. Boot interface options include Ethernet, Serial RapidIO interface, 2 DMA controller with 32 unidirectional channels supporting 16 I C, and SPI. memory-to-memory channels with up to 1024 buffer descriptors Supports standard JTAG interface per channel, and programmable priority, buffer, and multiplexing Low power CMOS design, with low-power standby and configuration. It is optimized for DDR SDRAM. power-down modes, and optimized power-management circuitry. Up to four independent TDM modules with programmable word 45 nm SOI CMOS technology. size (2, 4, 8, or 16-bit), hardware-base A-law/-law conversion, up to 62.5 Mbps data rate for each TDM link, and with glueless interface to E1 or T1 framers that can interface with H-MVIP/H.110 devices, TSI, and codecs such as AC-97. 20102013 Freescale Semiconductor, Inc. Table of Contents 1 Pin Assignment .4 Figure 10.SGMII Transmitter DC Measurement Circuit . 35 1.1 FC-PBGA Ball Layout Diagram 4 Figure 11.DDR2 and DDR3 SDRAM Interface Input Timing 1.2 Signal List By Ball Location .5 Diagram . 38 2 Electrical Characteristics 23 Figure 12.MCK to MDQS Timing 39 2.1 Maximum Ratings .23 Figure 13.DDR SDRAM Output Timing . 40 2.2 Recommended Operating Conditions 24 Figure 14.DDR2 and DDR3 Controller Bus AC Test Load . 40 2.3 Thermal Characteristics 25 Figure 15.DDR2 and DDR3 SDRAM Differential Timing 2.4 CLKIN Requirements 25 Specifications . 40 2.5 DC Electrical Characteristics 26 Figure 16.Differential Measurement Points for Rise and Fall Time 42 2.6 AC Timing Characteristics .37 Figure 17.Single-Ended Measurement Points for Rise and Fall Time 3 Hardware Design Considerations 54 Matching 42 3.1 Power Supply Ramp-Up Sequence .54 Figure 18.Single Frequency Sinusoidal Jitter Limits . 44 3.2 PLL Power Supply Design Considerations 57 Figure 19.SGMII AC Test/Measurement Load 45 3.3 Clock and Timing Signal Board Layout Considerations 58 Figure 20.TDM Receive Signals 46 3.4 SGMII AC-Coupled Serial Link Connection Example 58 Figure 21.TDM Transmit Signals 47 3.5 Connectivity Guidelines 59 Figure 22.TDM AC Test Load 47 3.6 Guide to Selecting Connections for Remote Power Figure 23.Timer AC Test Load 47 Supply Sensing .64 Figure 24.MII Management Interface Timing . 48 4 Ordering Information 65 Figure 25.RGMII AC Timing and Multiplexing 49 5 Package Information 66 Figure 26.SPI AC Test Load . 50 6 Product Documentation .67 Figure 27.SPI AC Timing in Slave Mode (External Clock) . 50 7 Revision History .67 Figure 28.SPI AC Timing in Master Mode (Internal Clock) 51 Figure 29.Test Clock Input Timing . 52 Figure 30.Boundary Scan (JTAG) Timing . 53 List of Figures Figure 31.Test Access Port Timing 53 Figure 1. MSC8152 Block Diagram 3 Figure 32.TRST Timing . 53 Figure 2. StarCore SC3850 DSP Subsystem Block Diagram 3 Figure 33.Supply Ramp-Up Sequence with V Ramping Before DD Figure 3. MSC8152 FC-PBGA Package, Top View 4 V and CLKIN Starting With V . 54 DDIO DDIO Figure 4. Differential Voltage Definitions for Transmitter or Figure 34.Supply Ramp-Up Sequence . 56 Receiver 28 Figure 35.Reset Connection in Functional Application . 56 Figure 5. Receiver of SerDes Reference Clocks . 30 Figure 36.Reset Connection in Debugger Application 56 Figure 6. SerDes Transmitter and Receiver Reference Circuits . 31 Figure 37.PLL Supplies . 57 Figure 7. Differential Reference Clock Input DC Requirements Figure 38.SerDes PLL Supplies 57 (External DC-Coupled) . 31 Figure 39.4-Wire AC-Coupled SGMII Serial Link Connection Figure 8. Differential Reference Clock Input DC Requirements Example . 58 (External AC-Coupled) . 32 Figure 40.MSC8152 Mechanical Information, 783-ball FC-PBGA Figure 9. Single-Ended Reference Clock Input DC Requirements 32 Package . 66 MSC8152 Dual-Core Digital Signal Processor Data Sheet, Rev. 6 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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