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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LVT16374 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs January 1999 Revised June 2005 74LVT16374 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs General Description Features The LVT16374 and LVTH16374 contain sixteen non-invert- Input and output interface capability to systems at ing D-type flip-flops with 3-STATE outputs and is intended 5V V CC for bus oriented applications. The device is byte controlled. Bushold data inputs eliminate the need for external A buffered clock (CP) and Output Enable (OE) are com- pull-up resistors to hold unused inputs (74LVTH16374), mon to each byte and can be shorted together for full 16-bit also available without bushold feature (74LVT16374) operation. Live insertion/extraction permitted The LVTH16374 data inputs include bushold, eliminating Power Up/Power Down high impedance provides the need for external pull-up resistors to hold unused glitch-free bus loading inputs. Outputs source/sink 32 mA/ 64 mA These flip-flops are designed for low-voltage (3.3V) V CC Functionally compatible with the 74 series 16374 applications, but with the capability to provide a TTL inter- face to a 5V environment. The LVT16374 and LVTH16374 Latch-up performance exceeds 500 mA are fabricated with an advanced BiCMOS technology to ESD performance: achieve high speed operation similar to 5V ABT while Human-body model 2000V maintaining a low power dissipation. Machine model 200V Charged-device model 1000V Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description 74LVT16374G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) (Preliminary) 74LVT16374MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide (Note 2) 74LVT16374MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) 74LVTH16374G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) 74LVTH16374MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide (Note 2) 74LVTH16374MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: Ordering code G indicates Trays. Note 2: Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering code. 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