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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LVT574, 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs January 2008 74LVT574, 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs Features General Description Input and output interface capability to systems at The LVT574 and LVTH574 are high-speed, low-power 5V V octal D-type flip-flop featuring separate D-type inputs for CC each flip-flop and 3-STATE outputs for bus-oriented Bushold data inputs eliminate the need for external applications. A buffered Clock (CP) and Output Enable pull-up resistors to hold unused inputs (74LVTH574), (OE) are common to all flip-flops. also available without bushold feature (74LVT574) Live insertion/extraction permitted The LVTH574 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused Power Up/Down high impedance provides glitch-free inputs. bus loading Outputs source/sink 32mA/+64mA These octal flip-flops are designed for low-voltage (3.3V) Functionally compatible with the 74 series 574 V applications, but with the capability to provide a TTL CC interface to a 5V environment. The LVT574 and Latch-up performance exceeds 500mA LVTH574 are fabricated with an advanced BiCMOS ESD performance: technology to achieve high speed operation similar to 5V Human-body model > 2000V ABT while maintaining a low power dissipation. Machine model > 200V Charged-device model > 1000V Ordering Information Package Order Number Number Package Description 74LVT574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVT574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVT574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVTH574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVTH574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LVT574, 74LVTH574 Rev. 1.6.0