ARRAYX-BOB3-144P-GEVK ON Semiconductor

DATA SHEET www.onsemi.com Silicon Photomultiplier (SiPM) High Fill-Factor Arrays ArrayJ Series onsemis range of JSeries SiPM sensors have been used to create high fillfactor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with S1 S2 industryleading fill factor of up to 90%. F1 F2 The back of each ArrayJ has either one or more multiway connectors, or a BGA (ball grid array). These allow access to the fast Common output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. Sn+1 Sn+2 The ArrayJ products with connectors can be used to interface with the users own readout via a mating connector, or to a onsemi Fn+1 Fn+2 Breakout Board (BOB). The BOBs allow for easy access to the pixel signals and performance evaluation of the arrays. ArrayJ products with the BGA can be reflow soldered to the users Figure 1. Signal connections at the pixel readout boards, or purchased readymounted on a pinned PCB level on the ArrayJ products. evaluation board for easy testing. A BGA ArrayJ cannot be removed from its PCB evaluation board. This contrasts with an ArrayJ with connectors, as multiple arrays can be evaluated with a single BOB. ArrayJ Inputs and Outputs (I/O) ATTENTION Figure 1 summarizes the array schematic for a portion of an ArrayJ. Great care should be taken when disconnecting the ArrayJ PCBs from the mating connectors, either on one Each SiPM sensor in the array has three electrical connections: fast of the BOBs, or the users own boards. output, standard output and common. The board should be gently levered up, working The substrates (cathodes) of all sensors are summed together to progressively around the board to lever the PCB from the form the common I/O. connector a little on all sides, and then repeating the Each individual fast output and standard I/O (anode) are routed to its process until the connectors are free from each other. own output pin. Use of Scintillators with the ArrayJ The pixellevel performance of the sensors in the array can be found Products in the JSeries datasheet. Please consult the Application Note on the use of scintillators with the TSV arrays. Table of Contents ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels).................... 2 ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) ......... 5 ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) ... 7 ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) .................... 9 ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) .................... 12 ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) .................. 17 ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) .............. 19 ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) .................. 21 ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P Breakout Board) ..................................................... 25 Biasing and Readout from the Standard Breakout Boards ................. 27 Appendix A ......................................................... 29 Appendix B ......................................................... 30 Appendix C ......................................................... 31 Ordering Information ................................................. 32 * The fast output is not available on the 2x2 array (ARRAYJ600354P). Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: September, 2021 Rev. 7 ARRAYJSERIES/DArrayJ Series ARRAYJ6003564PPCB (8 X 8 Array of 6 mm Pixels) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 2 8 x 8 60035 Pixel 50.44 x 50.44 mm 6.33 mm 160 2 x 80way The ARRAYJ6003564P is comprised of 64 individual 6mm JSeries sensors arranged in a 8 x 8 array. The performance of the individual pixels and details of the bias to apply can be found in the JSeries datasheet. The connections to each array are provided by two Samtec 80way connectors, type QTE04003F D A. These connectors mate with the Samtec QSE04001F D A boardtoboard connector and the Samtec EQCD High Speed Cable Assemblies. The 64 SiPM pixels all have substrate connections (cathode) summed to form a common I/O. The 80way connectors provide connections as follows: 64 x fast output 64 x standard I/O 32 x common I/O 16 x shield contacts to the Common ARRAYJ6003564P Board Drawing 8 1 J1 J2 64 57 The complete ARRAYJ6003564PPCB CAD is available to download. www.onsemi.com 2