X-On Electronics has gained recognition as a prominent supplier of FDMS2508SDC MOSFETs across the USA, India, Europe, Australia, and various other global locations. FDMS2508SDC MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

FDMS2508SDC ON Semiconductor

FDMS2508SDC electronic component of ON Semiconductor
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Part No.FDMS2508SDC
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET 25V N-Chan Dual Cool PowerTrench SyncFET
Datasheet: FDMS2508SDC Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
253: USD 1.6665 ea
Line Total: USD 421.62 
Availability - 0
MOQ: 253  Multiples: 253
Pack Size: 253
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 253
Multiples : 253
253 : USD 1.6665

0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 6.8191
10 : USD 2.4104
100 : USD 1.9918
250 : USD 1.9538
500 : USD 1.8649
1000 : USD 1.6366
3000 : USD 1.6366
6000 : USD 1.5858

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
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Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Gate Charge Qg
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We are delighted to provide the FDMS2508SDC from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDMS2508SDC and other electronic components in the MOSFETs category and beyond.

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TM TM FDMS2508SDC N-Channel Dual Cool PowerTrench SyncFET July 2013 FDMS2508SDC TM TM N-Channel Dual Cool PowerTrench SyncFET 25 V, 49 A, 1.95 m Features General Description TM Dual Cool Top Side Cooling PQFN package This N-Channel MOSFET is produced using Fairchild Semiconductors advanced PowerTrench process. Max r = 1.95 m at V = 10 V, I = 28 A DS(on) GS D TM Advancements in both silicon and Dual Cool package Max r = 2.85 m at V = 4.5 V, I = 22 A technologies have been combined to offer the lowest r DS(on) GS D DS(on) while maintaining excellent switching performance by extremely High performance technology for extremely low r DS(on) low Junction-to-Ambient thermal resistance. This device has the SyncFET Schottky Body Diode added benefit of an efficient monolithic Schottky body diode. RoHS Compliant Applications Synchronous Rectifier for DC/DC Converters Telecom Secondary Side Rectification High End Server/Workstation Vcore Low Side Pin 1 S S D G 5 4 S G D 6 3 S D S 7 2 D D D S D 8 1 D Top Power 56 Bottom MOSFET Maximum Ratings T = 25C unless otherwise noted A Symbol Parameter Ratings Units V Drain to Source Voltage 25 V DS V Gate to Source Voltage (Note 4) 20 V GS Drain Current -Continuous (Package limited) T = 25 C 49 C -Continuous (Silicon limited) T = 25 C 163 C I A D -Continuous T = 25 C (Note 1a) 34 A -Pulsed 200 E Single Pulse Avalanche Energy (Note 3) 144 mJ AS dv/dt Peak Diode Recovery dv/dt (Note 5) 1.9 V/ns Power Dissipation T = 25 C 78 C P W D Power Dissipation T = 25 C (Note 1a) 3.3 A T , T Operating and Storage Junction Temperature Range -55 to +150 C J STG Thermal Characteristics R Thermal Resistance, Junction to Case (Top Source) 3.5 JC R Thermal Resistance, Junction to Case (Bottom Drain) 1.6 JC R Thermal Resistance, Junction to Ambient (Note 1a) 38 JA R Thermal Resistance, Junction to Ambient (Note 1b) 81 JA C/W R Thermal Resistance, Junction to Ambient (Note 1i) 16 JA R Thermal Resistance, Junction to Ambient (Note 1j) 23 JA R Thermal Resistance, Junction to Ambient (Note 1k) 11 JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity TM 2508S FDMS2508SDC Dual Cool Power 56 13 12 mm 3000 units 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDMS2508SDC Rev.C1 TM TM FDMS2508SDC N-Channel Dual Cool PowerTrench SyncFET Electrical Characteristics T = 25 C unless otherwise noted J Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV Drain to Source Breakdown Voltage I = 1 mA, V = 0 V 25 V DSS D GS BV Breakdown Voltage Temperature DSS I = 10 mA, referenced to 25 C 22 mV/C D T Coefficient J I Zero Gate Voltage Drain Current V = 20 V, V = 0 V 500 A DSS DS GS I Gate to Source Leakage Current, Forward V = 20 V, V = 0 V 100 nA GSS GS DS On Characteristics V Gate to Source Threshold Voltage V = V , I = 1 mA 1.2 1.7 3.0 V GS(th) GS DS D V Gate to Source Threshold Voltage GS(th) I = 10 mA, referenced to 25 C -5 mV/C D T Temperature Coefficient J V = 10 V, I = 28 A 1.6 1.95 GS D r Static Drain to Source On Resistance V = 4.5 V, I = 22 A 2.3 2.85 m DS(on) GS D V = 10 V, I = 28 A, T = 125 C 2.4 3.0 GS D J g Forward Transconductance V = 5 V, I = 28 A 170 S FS DS D Dynamic Characteristics C Input Capacitance 3392 4515 pF iss V = 13 V, V = 0 V, DS GS C Output Capacitance 912 1215 pF oss f = 1 MHz C Reverse Transfer Capacitance 172 260 pF rss R Gate Resistance 1.2 2.1 g Switching Characteristics t Turn-On Delay Time 14 25 ns d(on) t Rise Time 5.9 12 ns V = 13 V, I = 28 A, r DD D V = 10 V, R = 6 t Turn-Off Delay Time 34 55 ns GS GEN d(off) t Fall Time 410 ns f Q Total Gate Charge V = 0 V to 10 V 49 69 nC g GS Q Total Gate Charge V = 0 V to 4.5 V 22 32 nC V = 13 V, g GS DD I = 28 A Q Gate to Source Gate Charge 9.9 nC D gs Q Gate to Drain Miller Charge 5.3 nC gd Drain-Source Diode Characteristics V = 0 V, I = 2 A (Note 2) 0.43 0.8 GS S V Source to Drain Diode Forward Voltage V SD V = 0 V, I = 28 A (Note 2) 0.78 1.2 GS S t Reverse Recovery Time 28 45 ns rr I = 28 A, di/dt = 300 A/s F Q Reverse Recovery Charge 27 43 nC rr 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com 2 FDMS2508SDC Rev.C1

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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