FFSP0865A Silicon Carbide Schottky Diode 650 V, 8 A Description www.onsemi.com Silicon Carbide (SiC) Schottky Diodes use a completely new technology that provides superior switching performance and higher reliability compared to Silicon. No reverse recovery current, temperature independent switching characteristics, and excellent thermal performance sets Silicon Carbide as the next generation of power semiconductor. System benefits include highest efficiency, 1. Cathode 2. Anode faster operating frequency, increased power density, reduced EMI, and Schottky Diode reduced system size & cost. Features Max Junction Temperature 175C Avalanche Rated 49 mJ High Surge Current Capacity Positive Temperature Coefficient Ease of Paralleling 1 2 No Reverse Recovery/No Forward Recovery TO2202LD These Devices are PbFree, Halogen Free/BFR Free and are RoHS CASE 340BB Compliant MARKING DIAGRAM Applications General Purpose SMPS, Solar Inverter, UPS Power Switching Circuits Y&Z&3&K FFSP 0865A Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = Numeric Date Code &K = Lot Code FFSP0865A = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: September, 2019 Rev. 2 FFSP0865A/DFFSP0865A ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) C Symbol Parameter Value Unit V Peak Repetitive Reverse Voltage 650 V RRM E Single Pulse Avalanche Energy (Note 1) 49 mJ AS I Continuous Rectified Forward Current T < 155C 8 A F C Continuous Rectified Forward Current T < 135C 13 C I Non-Repetitive Peak Forward Surge Current T = 25C, 10 s 750 A F, Max C 730 A T = 150C, 10 s C I Non-Repetitive Forward Surge Current Half-Sine Pulse, t = 8.3 ms 49 A F,SM p I Repetitive Forward Surge Current Half-Sine Pulse, t = 8.3 ms 34 A F,RM p Ptot Power Dissipation T = 25C 98 W C T = 150C 16 W C T , T Operating and Storage Temperature Range 55 to +175 C J STG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. E of 49 mJ is based on starting T = 25C, L = 0.5 mH, I = 14 A, V = 50 V. AS J AS THERMAL CHARACTERISTICS Symbol Parameter Value Unit R Thermal Resistance, Junction to Case, Max 1.53 C/W JC ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Symbol Parameter Test Condition Min Typ Max Unit V Forward Voltage I = 8 A, T = 25C 1.50 1.75 V F F C I = 8 A, T = 125C 1.6 2.0 F C I = 8 A, T = 175C 1.72 2.40 F C I Reverse Current V = 650 V, T = 25C 200 A R R C V = 650 V, T = 125C 400 R C V = 650 V, T = 175C 600 R C Q Total Capacitive Charge V = 400 V 27 nC C C Total Capacitance V = 1 V, f = 100 kHz 463 pF R V = 200 V, f = 100 kHz 48 R V = 400 V, f = 100 kHz 38 R Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Marking Package Packing Method Quantity FFSP0865A FFSP0865A TO2202LD Tube 50 Units (Pb-Free / Halogen Free) www.onsemi.com 2