DATA SHEET www.onsemi.com Surface Mount SCHOTTKY BARRIER Schottky Power Rectifier RECTIFIER Plastic SOD 123 Package 1.0 AMPERES 40 VOLTS MBR140ESF, NRVB140ESF This device uses the Schottky Barrier principle with a large area metaltosilicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight SOD123FL are critical to the system. This package also provides an easy to work CASE 498 with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as MARKING DIAGRAM cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are ACDC and DCDC converters, reverse battery protection, and Oring of E4FM multiple supply voltages and any other application where performance and size are critical. E4F = Specific Device Code M = Date Code Features = PbFree Package) Guardring for Stress Protection (Note: Microdot may be in either location) Low Reverse Leakage 175C Operating Junction Temperature ORDERING INFORMATION Epoxy Meets UL 94 V0 0.125 in Device Package Shipping Package Designed for Optimal Automated Board Assembly ESD Rating: MBR140ESFT1G SOD123FL 3,000 / (PbFree) Tape & Reel ** Human Body Model = 3B Machine Model = M4 MBR140ESFT3G SOD123FL 10,000 / (PbFree) Tape & Reel *** NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 NRVB140ESFT1G SOD123FL 3,000 / Qualified and PPAP Capable (PbFree) Tape & Reel ** These Devices are PbFree and are RoHS Compliant* NRVB140ESFT3G SOD123FL 10,000 / (PbFree) Tape & Reel *** Mechanical Characteristics For information on tape and reel specifications, Device Marking: E4F including part orientation and tape sizes, please Polarity Designator: Cathode Band refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Weight: 11.7 mg (approximately) ** 8 mm Tape, 7 Reel Case: Epoxy, Molded *** 8 mm Tape, 13 Reel Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds *For additional information on our PbFree strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: October, 2021 Rev. 4 MBR140ESF/DMBR140ESF, NRVB140ESF MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage V 40 V RRM Working Peak Reverse Voltage V RWM DC Blocking Voltage V R Average Rectified Forward Current I 1.0 A O Peak Repetitive Forward Current I 2.0 A FRM NonRepetitive Peak Surge Current I A FSM (NonRepetitive peak surge current, halfwave, single phase, 60 Hz) 30 Storage Temperature T 55 to 175 C stg Operating Junction Temperature T 55 to 175 C J Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance, JunctiontoLead (Note 1) R 26 C/W tjl Thermal Resistance, Junction toLead (Note 2) R 21 tjl Thermal Resistance, JunctiontoAmbient (Note 1) R 325 tja Thermal Resistance, JunctiontoAmbient (Note 2) R 82 tja 1. Mounted with minimum recommended pad size, PC Board FR4. 2 2. Mounted with 1 in. copper pad (Cu area 700 mm ). ELECTRICAL CHARACTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 3) V T = 25C V F J (I = 1.0 A) 0.56 F I Maximum Instantaneous Reverse Current (Note 3) T = 25C A R J (V = 40 V) 30 R 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2%. www.onsemi.com 2