MC74AC20D ON Semiconductor

MC74AC20, MC74ACT20 Dual 4-Input NAND Gate HighPerformance SiliconGate CMOS Features Outputs Source/Sink 24 mA www.onsemi.com ACT20 Has TTL Compatible Inputs MARKING These are PbFree Devices DIAGRAM 14 V A B NC C D O CC 1 1 1 1 1 SOIC14 xxx20G 14 13 12 11 10 9 8 D SUFFIX AWLYWW CASE 751A 14 1 1 xxx = AC or ACT A = Assembly Location WL = Wafer Lot 132 4 56 7 Y = Year WW = Work Week A B NC C D O GND 0 0 0 0 0 G = PbFree Package Figure 1. Pinout: 14-Lead Packages (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package PIN ASSIGNMENT dimensions section on page 5 of this data sheet. PIN FUNCTION A , B , C , Inputs n n n D n O Outputs n Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2015 Rev. 9 MC74AC20/DMC74AC20, MC74ACT20 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to 7.0 V CC V DC Input Voltage 0.5  V  V 0.5 V I I CC V DC Output Voltage (Note 1) 0.5  V  V 0.5 V O O CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA O I DC Supply Current per Output Pin 50 mA CC I DC Ground Current per Output Pin 50 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction temperature under Bias 150 C J  Thermal Resistance (Note 2) 125 C/W JA P Power Dissipation in Still Air at 85C 125 mW D MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 @ 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I LatchUp Performance Above V and Below GND at 85C (Note 6) 100 mA LatchUp CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. O 2. The package thermal impedance is calculated in accordance with JESD517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Min Unit AC 2.0 5.0 6.0 V Supply Voltage V CC ACT 4.5 5.0 5.5 VREG DC Regulated Power Voltage (Ref. to GND) 0 V V CC V @ 3.0 V 150 CC Input Rise and Fall Time (Note 1) t , t V @ 4.5 V 40 ns/V r f CC AC Devices except Schmitt Inputs V @ 5.5 V 25 CC V @ 4.5 V 10 CC Input Rise and Fall Time (Note 2) t , t ns/V r f ACT Devices except Schmitt Inputs V @ 5.5 V 8.0 CC T Junction Temperature (PDIP) 140 C J T Operating Ambient Temperature Range 40 25 85 C A I Output Current HIGH 24 mA OH I Output Current LOW 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times. in CC 2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. in www.onsemi.com 2