Micro-stepping Motor Driver NCV70627 Introduction The NCV70627 is a singlechip microstepping motor driver with position controller and control/diagnostic interface. It is ready to build dedicated mechatronics solutions connected remotely with a LIN master. www.onsemi.com The chip receives positioning instructions through the bus and subsequently drives the motor coils to the desired position. The onchip position controller is configurable (OTP or RAM) for different motor types, positioning ranges and parameters for speed, acceleration and deceleration. The NCV70627 acts as a slave on the LIN bus and the master can fetch specific status information like actual position, error 1 32 flags, etc. from each individual slave node. SSOPEP QFN32, 5x5 36 LEAD CASE 488AM An integrated sensorless steploss detection prevents the positioner CASE 940AB from loosing steps and stops the motor when running into stall. This enables silent, yet accurate position calibrations during a referencing run and allows semiclosed loop operation when approaching the ORDERING INFORMATION mechanical endstops. See detailed ordering, marking and shipping information in the The chip is implemented in I3T50 technology, enabling both high package dimensions section on page 2 of this data sheet. voltage analog circuitry and digital functionality on the same chip. The NCV70627 is fully compatible with the automotive voltage requirements. Due to the technology, the device is especially suited for use in applications with fluctuating battery supplies. PRODUCT FEATURES Motordriver Microstepping Technology Sensorless Steploss Detection Peak Current up to 800 mA Low Temperature Boost Current up to 1100 mA Protection Programmable Current Stabilization Phase Overcurrent Protection Fixed Frequency PWM Currentcontrol Opencircuit Detection Automatic Selection of Fast and Slow Decay Mode High Temperature Warning and Management No External Flyback Diodes Required Low Temperature Flag Compliant with 14 V Automotive Systems LIN Bus Shortcircuit Protection to Supply and Ground Controller with RAM and OTP Memory Lost LIN Safe Operation Position Controller Enhanced Under Voltage Management Configurable Speeds and Acceleration Power Saving Input to Connect Optional Motion Switch Powerdown Supply Current < 150 A LIN Interface 3.3 V Regulator with Wakeup On LIN Activity Physical Layer Compliant to LIN rev. 2.0. Datalink EMI Compatibility Layer Compatible with LIN rev. 1.3 (Note 1) LIN Bus Integrated Slope Control Fieldprogrammable Node Addresses HV Outputs with Slope Control Dynamically Allocated Identifiers This is a PbFree Device Diagnostics and Status Information 1. Minor exceptions to the conformance of the datalink layer to LIN rev. 1.3. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: April, 2021 Rev. 3 NCV70627/DNCV70627 Applications The NCV70627 is ideally suited for small positioning surveillance, satellite dish, renewable energy systems). applications. Target markets include: automotive (headlamp Suitable applications typically have multiple axes or require alignment, HVAC, idle control, cruise control), industrial mechatronics solutions with the driver chip mounted equipment (lighting, fluid control, labeling, process control, directly on the motor. XYZ tables, robots...) and building automation (HVAC, Table 1. ORDERING INFORMATION Part No. Peak Current End Market/Version Package* Shipping NCV70627DQ002AR2G 800/1100 mA (Note 2) Automotive SSOP36EP 1500/Tape & Reel High Temperature (PbFree) Version NCV70627MW002AR2G 800/1100 mA (Note 2) Automotive QFN32 5000 / Tape & Reel (PbFree) *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 2. The device boost current. This applies for operation under the thermal warning level only. MARKING DIAGRAMS 1 F = Fab Location A = Assembly Location NCV706272 N706272 WL = Wafer Lot FAWLYYWWG FAWLYYWW YY = Year WW = Work Week G or = PbFree Package SSOP QFN32 Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Min Max Unit V , VHW2 Supply voltage, hardwired address pin (Note 4) 0.3 +40 (Note 3) V BB Vlin Bus input voltage (Note 4) 40 +40 V T Junction temperature range (Note 5) 50 +175 C J T Storage temperature range (Note 6) 55 +160 C stg Vesd (Note 7) HBM Electrostatic discharge voltage on LIN pin 4 +4 kV HBM Electrostatic discharge voltage on other pins 2 +2 kV MM Electrostatic discharge voltage on other pins 200 +200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: A mission profile (Note 5) is a substantial part of the operation conditions hence the Customer must contact ON Semiconductor in order to mutually agree in writing on the allowed missions profile(s) in the application. 3. For limited time: V <0.5 s, SWI and HW2 pins <1.0 s. BB 4. Maximum allowed voltage between two device pins is 60 V. 5. The circuit functionality is not guaranteed outside the Operating junction temperature range. A mission profile describes the application specific conditions such as, but not limited to, the cumulative operating conditions over life time, the system power dissipation, the systems environmental conditions, the thermal design of the customers system, the modes, in which the device is operated by the customer, etc. 6. For limited time up to 100 hours. Otherwise the maximum storage temperature is 85C. 7. HBM according to AECQ100: EIAJESD22A114B (100 pF via 1.5 k ) and MM according to AECQ100: EIAJESD22A115A. Table 3. OPERATING RANGES Parameter Min Max Unit V Supply voltage +5.5 +29 V BB T Parametric Operating junction temperature range (Note 8) 40 +145 C JP T Functional Operating junction temperature range (Note 9) 40 +160 C JF 8. The parametric characteristics of the circuit are not guaranteed outside the parametric operating junction temperature range. 9. The maximum functional operating temperature range can be limited by thermal shutdown Ttsd. www.onsemi.com 2