X-On Electronics has gained recognition as a prominent supplier of NTMFS4C09NT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTMFS4C09NT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTMFS4C09NT1G ON Semiconductor

NTMFS4C09NT1G electronic component of ON Semiconductor
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Part No.NTMFS4C09NT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: ON Semiconductor MOSFET
Datasheet: NTMFS4C09NT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.9856 ea
Line Total: USD 0.99 
Availability - 2815
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
9
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 1
Multiples : 1
1 : USD 2.725
10 : USD 2.3701
30 : USD 2.1487
100 : USD 1.9216
500 : USD 1.8186
1500 : USD 1.7747

2815
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.9856
10 : USD 0.6204
100 : USD 0.418
250 : USD 0.3916
500 : USD 0.3399
1000 : USD 0.3168
1500 : USD 0.2937
3000 : USD 0.2673
9000 : USD 0.2585

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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We are delighted to provide the NTMFS4C09NT1G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTMFS4C09NT1G and other electronic components in the MOSFETs category and beyond.

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NTMFS4C09N MOSFET Power, Single, N-Channel, SO-8 FL 30 V, 52 A Features www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses V R MAX I MAX Optimized Gate Charge to Minimize Switching Losses (BR)DSS DS(ON) D These Devices are PbFree, Halogen Free/BFR Free and are RoHS 5.8 m 10 V 30 V 52 A Compliant 8.5 m 4.5 V Applications D (58) CPU Power Delivery DCDC Converters MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit G (4) DraintoSource Voltage V 30 V DSS GatetoSource Voltage V 20 V GS S (1,2,3) T = 25C 16.4 Continuous Drain I A A D NCHANNEL MOSFET Current R JA T = 80C 12.3 (Note 1) A MARKING Power Dissipation T = 25C P 2.51 W A D DIAGRAMS R (Note 1) JA D Continuous Drain T = 25C I 25.3 A A D S D Current R 10 s SO8 FLAT LEAD JA S 4C09N T = 80C 19.0 A (Note 1) CASE 488AA AYWZZ S STYLE 1 Power Dissipation T = 25C P 6.0 W A D G D R 10 s (Note 1) 1 JA Steady D State Continuous Drain T = 25C I 9.0 A A D A = Assembly Location Current R JA T = 80C 6.8 A (Note 2) Y = Year W = Work Week Power Dissipation T = 25C P 0.76 W A D ZZ = Lot Traceabililty R (Note 2) JA Continuous Drain T = 25C I 52 A C D Current R JC ORDERING INFORMATION T =80C 39 C (Note 1) Power Dissipation T = 25C P 25.5 W C D Device Package Shipping R (Note 1) JC NTMFS4C09NT1G SO8 FL 1500 / Pulsed Drain T = 25C, t = 10 s I 146 A DM A p (PbFree) Tape & Reel Current NTMFS4C09NT3G SO8 FL 5000 / Current Limited by Package T = 25C I 80 A A Dmax (PbFree) Tape & Reel Operating Junction and Storage T , 55 to C J Temperature T +150 STG For information on tape and reel specifications, including part orientation and tape sizes, please Source Current (Body Diode) I 23 A S refer to our Tape and Reel Packaging Specifications Drain to Source dV/dt dV/d 7.0 V/ns t Brochure, BRD8011/D. Single Pulse DraintoSource Avalanche E 42 mJ AS Energy (T = 25C, V = 10 V, I = 29 A , J GS L pk L = 0.1 mH, R = 25 ) (Note 3) GS Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: May, 2019 Rev. 5 NTMFS4C09N/DNTMFS4C09N 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. 3. Parts are 100% tested at T = 25C, V = 10 V, I = 20 A , EAS = 20 mJ. J GS L pk THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 4.9 JC JunctiontoAmbient Steady State (Note 4) R 49.8 JA C/W JunctiontoAmbient Steady State (Note 5) 164.6 R JA JunctiontoAmbient (t 10 s) (Note 4) R 21.0 JA 4. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 5. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V V = 0 V, I = 8.4 A, 34 (BR)DSSt GS D(aval) V (transient) T = 25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 14.4 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V V = V , I = 250 A 1.3 2.1 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 4.8 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 4.6 5.8 DS(on) GS D m V = 4.5 V I = 18 A 6.8 8.5 GS D Forward Transconductance g V = 1.5 V, I = 15 A 50 S FS DS D Gate Resistance R T = 25C 0.3 1.0 2.0 G A CHARGES AND CAPACITANCES Input Capacitance C 1252 ISS Output Capacitance C 610 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 126 RSS Capacitance Ratio C /C V = 0 V, V = 15 V, f = 1 MHz 0.101 RSS ISS GS DS Total Gate Charge Q 10.9 G(TOT) Threshold Gate Charge Q 1.9 G(TH) nC GatetoSource Charge Q 3.4 V = 4.5 V, V = 15 V I = 30 A GS GS DS D GatetoDrain Charge Q 5.4 GD Gate Plateau Voltage V 3.1 V GP Total Gate Charge Q V = 10 V, V = 15 V I = 30 A 22.2 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 7) 6. Pulse Test: pulse width 300 s, duty cycle 2%. 7. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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