X-On Electronics has gained recognition as a prominent supplier of NTMFS5H419NLT1G MOSFET across the USA, India, Europe, Australia, and various other global locations. NTMFS5H419NLT1G MOSFET are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

NTMFS5H419NLT1G ON Semiconductor

NTMFS5H419NLT1G electronic component of ON Semiconductor
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See Product Specifications
Part No.NTMFS5H419NLT1G
Manufacturer: ON Semiconductor
Category: MOSFET
Description: MOSFET T8 40V LOW COSS
Datasheet: NTMFS5H419NLT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.7534 ea
Line Total: USD 1.75

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 02 Aug to Thu. 08 Aug
MOQ : 1500
Multiples : 1500
1500 : USD 0.9739
3000 : USD 0.9649
6000 : USD 0.956
9000 : USD 0.9469
12000 : USD 0.9379
15000 : USD 0.9289
24000 : USD 0.9198
30000 : USD 0.9107
75000 : USD 0.9017

0
Ship by Fri. 02 Aug to Thu. 08 Aug
MOQ : 1500
Multiples : 1500
1500 : USD 0.8811

0
Ship by Thu. 08 Aug to Mon. 12 Aug
MOQ : 1
Multiples : 1
1 : USD 1.7534
10 : USD 1.5372
100 : USD 1.2055
500 : USD 0.9747
1000 : USD 0.8444
1500 : USD 0.7851
3000 : USD 0.7688
9000 : USD 0.7688

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the NTMFS5H419NLT1G from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTMFS5H419NLT1G and other electronic components in the MOSFET category and beyond.

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NTMFS5H419NL MOSFET Power, Single, N-Channel 40 V, 2.1 m , 155 A Features Small Footprint (5x6 mm) for Compact Design www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G These Devices are PbFree and are RoHS Compliant V R MAX I MAX (BR)DSS DS(ON) D 2.1 m 10 V 40 V MAXIMUM RATINGS (T = 25C unless otherwise noted) 155 A J 3.1 m 4.5 V Parameter Symbol Value Unit DraintoSource Voltage V 40 V DSS D (5) GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 155 A C D Current R JC T = 100C 98 (Notes 1, 3) C Steady State Power Dissipation T = 25C P 89 W G (4) C D R (Note 1) JC T = 100C 36 C S (1,2,3) Continuous Drain T = 25C I 29 A A D Current R JA NCHANNEL MOSFET T = 100C 18 (Notes 1, 2, 3) A Steady State Power Dissipation T = 25C P 3.1 W D A R (Notes 1, 2) JA MARKING T = 100C 1.3 A DIAGRAM Pulsed Drain Current T = 25C, t = 10 s I 900 A A p DM D Operating Junction and Storage Temperature T , T 55 to C 1 J stg S D Range + 150 DFN5 S 5H419L (SO8FL) AYWZZ Source Current (Body Diode) I 74 A S S CASE 488AA G D Single Pulse DraintoSource Avalanche E 375 mJ AS STYLE 1 D Energy (I = 14 A) L(pk) 5H419L = Specific Device Code Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location (1/8 from case for 10 s) Y = Year Stresses exceeding those listed in the Maximum Ratings table may damage the W = Work Week device. If any of these limits are exceeded, device functionality should not be ZZ = Lot Traceability assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit ORDERING INFORMATION See detailed ordering, marking and shipping information on JunctiontoCase Steady State R 1.4 C/W JC page 5 of this data sheet. JunctiontoAmbient Steady State (Note 2) R 40 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 , 2 oz. Cu pad. 2. Surfacemounted on FR4 board using a 650 mm 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2019 Rev. 1 NTMFS5H419NL/DNTMFS5H419NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 15.6 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 40 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 250 A 1.2 2.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 4.6 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 20 A 1.7 2.1 DS(on) GS D m V = 4.5 V I = 20 A 2.5 3.1 GS D Forward Transconductance g V =15 V, I = 20 A 80 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 2900 ISS Output Capacitance C 675 V = 0 V, f = 1 MHz, V = 20 V pF OSS GS DS Reverse Transfer Capacitance C 37 RSS Output Charge Q V = 0 V, V = 20 V 29 nC OSS GS DD Total Gate Charge Q V = 10 V, V = 20 V I = 20 A 45 G(TOT) GS DS D Total Gate Charge Q 21 G(TOT) Threshold Gate Charge Q 4.8 nC G(TH) GatetoSource Charge Q 8.6 V = 4.5 V, V = 20 V I = 20 A GS GS DS D GatetoDrain Charge Q 5.4 GD Plateau Voltage V 3 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 24 d(ON) Rise Time t 56 r V = 4.5 V, V = 20 V, GS DS ns I = 20 A, R = 2.5 D G TurnOff Delay Time t 62 d(OFF) Fall Time t 15 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.8 1.2 SD J V = 0 V, GS V I = 20 A S T = 125C 0.6 J Reverse Recovery Time t 40 RR Charge Time t 23 a ns V = 0 V, dI /dt = 100 A/ s, GS S I = 20 A S Discharge Time t 17 b Reverse Recovery Charge Q 38 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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