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NTD5806N, NVD5806N Power MOSFET 40 V, 33 A, Single NChannel, DPAK/IPAK Features Low R DS(on) High Current Capability www.onsemi.com Avalanche Energy Specified NVD and SVD Prefix for Automotive and Other Applications V R MAX I MAX (BR)DSS DS(on) D Requiring Unique Site and Control Change Requirements 26 m 4.5 V AECQ101 Qualified and PPAP Capable 40 V 33 A 19 m 10 V These Devices are PbFree and are RoHS Compliant D Applications CCFL Backlight DC Motor Control NCHANNEL MOSFET Power Supply Secondary Side Synchronous Rectification G MAXIMUM RATINGS (T = 25C unless otherwise noted) S J Parameter Symbol Value Unit 4 DraintoSource Voltage V 40 V DSS GatetoSource Voltage Continuous V 20 V 4 GS GatetoSource Voltage V 30 V GS NonRepetitive (t < 10 S) 1 p 2 1 2 3 3 Continuous Drain T = 25C I 33 A D C DPAK IPAK Current (R ) JC Steady T = 100C 23 CASE 369C CASE 369D (Note 1) C State (Surface Mount) (Straight Lead DPAK) Power Dissipation T = 25C P 40 W C D STYLE 2 STYLE 2 (R ) (Note 1) JC Pulsed Drain Current I 67 A t = 10 s p DM MARKING DIAGRAMS Operating Junction and Storage Temperature T , T 55 to C & PIN ASSIGNMENT J stg 175 4 Drain Source Current (Body Diode) I 33 A S 4 Single Pulse DraintoSource Avalanche E 39 mJ AS Drain Energy (V = 50 V, V = 10 V, R = 25 , DD GS G I = 28 A, L = 0.1 mH, V = 40 V) L(pk) DS Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Stresses exceeding those listed in the Maximum Ratings table may damage the 2 device. If any of these limits are exceeded, device functionality should not be Drain assumed, damage may occur and reliability may be affected. 1 3 1 2 3 Gate Source Gate Drain Source THERMAL RESISTANCE MAXIMUM RATINGS A = Assembly Location* Y = Year Parameter Symbol Value Unit WW = Work Week JunctiontoCase (Drain) R 3.7 C/W JC 5806N = Device Code JunctiontoAmbient Steady State (Note 1) R 57.5 G = PbFree Package JA 1. Surfacemounted on FR4 board using 1 in sq pad size * The Assembly Location code (A) is front side (Cu area = 1.127 in sq 1 oz including traces. optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: July, 2016 Rev. 7 NTD5806N/D AYWW 58 06NG AYWW 58 06NG