EClamp2386P ESD/EMI Protection for Color LCD Interfaces TM PROTECTION PRODUCTS - EMIClampPROTECTION PRODUCTS PRELIMINARY Features Description TM The EClamp 2386P is a low pass filter array with Bidirectional EMI/RFI filter with integrated TVS integrated TVS diodes. It is designed to suppress for ESD protection unwanted EMI/RFI signals and provide electrostatic ESD protection to IEC 61000-4-2 (ESD) Level 4, discharge (ESD) protection in portable electronic 15kV (air), 8kV (contact) equipment. This state-of-the-art device utilizes solid- Filter performance: 30dB minimum attenuation state silicon-avalanche technology for superior clamp- 800MHz to 2.7GHz ing performance and DC electrical characteristics. TVS working voltage: 5V protection of colorprotection of colorprotection of color They have been optimized for protection of colorprotection of color Resistor: 200 +/ 15% LCD panelsLCD panelsLCD LCD panelsLCD panelspanels in cellular phones and other portable Total Capacitance: 12pF (VR = 2.5V) electronics. Protection and filtering for six lines The device consists of six identical circuits comprised Solid-state technology of TVS diodes for ESD protection, and a resistor - Mechanical Characteristics capacitor network for EMI/RFI filtering. A series resistor value of 200 and a capacitance value of 12pF SLP3016P12 12-pin package are used to achieve 30dB minimum attenuation from RoHS/WEEE Compliant 800MHz to 2.7GHz. The TVS diodes provide effective Nominal Dimensions: 3.0 x 1.6 x 0.58 mm suppression of ESD voltages in excess of 15kV (air Lead Pitch: 0.5mm discharge) and 8kV (contact discharge) per IEC 61000- Lead finish: NiPd 4-2, level 4. Marking: Marking Code Packaging: Tape and Reel per EIA 481 The EClamp2386P is in a 12-pin, RoHS/WEEE compli- ant, SLP3016P12 package. It measures 3.0 x 1.6 x Applications 0.58mm. The leads are spaced at a pitch of 0.5mm Color LCD Protection and are finished with lead-free NiPd. The small pack- Cell Phone CCD Camera Lines age makes it ideal for use in portable electronics such Clamshell Cell Phones as cell phones, digital still cameras, and PDAs. Circuit Diagram (Each Line) Package Configuration 3.00 1 2 200 1.60 IN OUT 12pF 12pF 0.50 BSC GND 0.58 Device Schematic (6X) 12 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 1/25/2006 1EClamp2386P PROTECTION PRODUCTS PRELIMINARY Maximum Ratings Rlating Seymbo Vsalu Unit ESD per IEC 61000-4-2 (Air) +/- 17 V kV ESD ESD per IEC 61000-4-2 (Contact) +/- 12 o JTunction Temperature 125 C J o OTperating Temperature -40 to +85 C op o STtorage Temperature -55 to +150 C STG o Electrical Characteristics (T = 25 C) PPrPPrPlaaaaarrrrraaaaammmmmeeeeettttteeeeerrr SSlSSlSsyyyyymmmmmbbbbboooooll CsCCCmCsooooonnnnndddddiiiiitttttiiiiiooooonnnnnss MmMMMlMmiiiiinnnnniiiiimmmmmuuuuumm TlTTTmTlyyyyypppppiiiiicccccaaaaall MmMMMsMmaaaaaxxxxxiiiiimmmmmuuuuumm UsUUUUsnnnnniiiiitttttss TVVS Reverse Stand-Off Voltage 5V RWM TVVS Reverse Breakdown Voltage I=61mA 8 1V0 BR t TIVS Reverse Leakage Current V=53.0V 0A. R RWM TRotal Series Resistance E0ach Line 107 200 2s3 Ohm CCapacitance C Each Line 120 151Fp 1, 2 V = 2.5V, f = 1MHz R TCotal Capacitance Input to Gnd, 240 203Fp in Each Line V = 2.5V, f = 1MHz R www.semtech.com 2006 Semtech Corp. 2