TClamp3302N Low Capacitance TVS for Ethernet and Telecom Interfaces PROTECTION PRODUCTS - TransClamp Features Description Transient protection for high-speed data lines to A TransClamp is a low capacitance TVS array designed to protect high speed data interfaces. This series has Bellcore 1089 (Intra-Building) 100A (2/10s) been specifically designed to protect sensitive compo- IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) nents which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic IEC 61000-4-5 (Lightning) L5, 95A (8/20s) discharge), CDE (Cable Discharge Events), and Light- Low capacitance (12pF line-to-line) ning. Low operating voltages (3.3V) These devices integrate low capacitance, surge-rated Low clamping voltage compensation diodes with a high power transient Small SLP Package saves board space voltage suppressor (TVS). The compensation diodes Solid-state technology are arranged in a bridge pattern allowing the device to be connected in common mode and/or differential Mechanical Characteristics mode. This allows the designer maximum flexibility and reduces parts count. The capacitance of the device is SLP2626P10 10L package limited to 12pF maximum from line-to-line to ensure RoHS/WEEE Compliant correct signal transmission on high-speed lines. Nominal Dimensions: 2.6 x 2.6 x 0.60 mm These devices may be used to meet Telcordia GR-1089- Lead Pitch: 0.5mm CORE short-haul (intra-building) surge requirements and Molding compound flammability rating: UL 94V-0 will withstand a minimum 100 A surge for a 2/10 s Marking: Marking Code pulse. TM Packaging: Tape and Reel The TClamp 3302N is in a 10-pin, RoHS/WEEE compli- ant, SLP2626P10 package. It measures 2.6 x 2.6 x Applications 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are 10/100/1000 Ethernet particularly well suited for applications where board T3/E3 space is at a premium such as integrated connectors/ Integrated Magnetics magnetics and carrier class Ethernet equipment. Carrier Class Equipment Customer Premise Equipment Circuit Diagram Package Configuration 2.60 C L 12 LINE 1 (1, 2, 3) 2.60 C L Center Tab 0.50 BSC 0.60 LINE 2 (8, 9, 10) 10 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 01/17/2008 1TClamp3302N PROTECTION PRODUCTS Absolute Maximum Rating Rlating Seymbo Vsalu Unit PPeak Pulse Power (tp = 2/10s) 2s500 Watt pk PIeak Pulse Current (tp = 2/10s) 1A20 PP PIeak Pulse Current (tp = 8/20s) 9A5 PP ESD per IEC 61000-4-2 (Air) V 30 kV ESD ESD per IEC 61000-4-2 (Contact) 30 OTperating Temperature -C40 to +85 J STtorage Temperature -C55 to +150 STG o Electrical Characteristics (T=25 C unless otherwise specified) TClamp3302N Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off VoltageT3=25C to 85C 3V. RWM PVunch-Through Voltage I = 2A3V.5 PT PT T=25C SVnap-Back Voltage I=850mA2V. SB SB RIeverse Leakage Current V=13.3V, T=25C A R RWM CVlamping Voltage I = 100A, tp = 2/10s 2V2 C PP Line-to-Ground CVlamping Voltage I = 100A, tp = 2/10s 2V5 C PP Line-to-Line JCunction Capacitance Between I/O pins and 2F5 p j Gnd V = 0V, f = 1MHz R Between I/O pins 1F2 p V = 0V, f = 1MHz R www.semtech.com 2008 Semtech Corp. 2