HDMI2C1-14HDS STMicroelectronics

HDMI2C1-14HDS ESD protection and signal conditioning for HDMI 2.0 and HDMI 1.4 source Datasheet production data Benefits Speed-up hardware design and certification of HDMI application Pin map sequence compliant with HDMI 24 23 22 21 20 19 18 connector type A 1 Minimal PCB footprint in consumer area 2 17 Ultra low power consumption in stand-by mode 3 16 Exposed thermal die Wake-up from stand-by through CEC bus 4 15 Improved HDMI interface ruggedness and user 14 5 experience 6 13 Long and/or poor quality cable support 78 910 11 12 Complies with the following standards HDMI standard IEC 61000-4-2 level 4 JESD22-A114D level 2 Features Applications HDMI compliant from -40 to 85 C 8 kV contact ESD protection on connector side Consumer and computer electronics HDMI Sink device such as: Supports direct connection to low-voltage HDMI ASIC and/or CEC driver (down to 1.8 V) HD set-top boxes DVD and Blu-Ray Disk systems TMDS high bandwidth ESD protection compatible with 4 K-2 K 60 fps. Notebook PC graphic cards DDC (I2C) link protection, bi-directional signal conditioning circuit, and dynamic pull-up HDMI : the HDMI logo and high definition CEC bus protection, bi-directional level-shifter, multimedia interface are trademarks or registered backdrive protection, and independent trademarks of HDMI Licensing LLC. structure from main power supply HEAC link protection Description HPD pull down and signal conditioning The HDMI2C1-14HDS is a fully integrated ESD Short-circuit protection on 5 V output protection and signal conditioning device for control links of HDMI transmitters (Source). Over temperature protection The HDMI2C1-14HDS is a simple solution that Proposed in QFN 24 leads 500 m pitch provides HDMI designers with an easy and fast way to reach full compliancy with the stringent HDMI CTS on a wide temperature range. September 2015 DocID025842 Rev 3 1/28 This is information on a product in full production. www.st.comHDMI2C1-14HDS Contents 1 Functional description . 3 2 Application information 4 2.1 CEC line description 4 2.2 DDC bus description . 5 2.3 HEAC link and HPD line description . 8 2.3.1 HPD line description 8 2.3.2 HEAC link 9 2.4 +5V protection and fault line 9 2.5 TMDS channels .11 2.6 Application block diagrams .11 3 Electrical characteristics 14 4 Package information 22 4.1 QFN package information 22 4.2 Packing information . 24 5 Recommendation on PCB assembly . 25 5.1 Stencil opening design . 25 5.2 Solder paste . 26 5.3 Placement 26 5.4 PCB design preference 26 5.5 Reflow profile 26 6 Ordering information . 27 7 Revision history . 27 2/28 DocID025842 Rev 3