INMP401 Omnidirectional Microphone with Bottom Port and Analog Output APPLICATIONS GENERAL DESCRIPTION * The INMP401 is a high-quality, high-performance, low- Mobile Devices power, analog-output bottom-ported omnidirectional MEMS Teleconferencing Systems microphone. The INMP401 consists of a MEMS microphone Headsets element, an impedance converter, and an output amplifier. Security Panels The INMP401 sensitivity specification makes it an excellent Intercom Devices choice for near-field applications. The INMP401 has a wideband frequency response, resulting in natural sound with high intelligibility. The specially designed low frequency cutoff FEATURES reduces wind noise. Its low current consumption enables long battery life for portable applications. 4.72 3.76 1.00 mm Surface-Mount Package SNR of 62 dBA The INMP401 complies with the TIA-920 Telecommunications Sensitivity of 42 dBV Telephone Terminal Equipment Transmission Requirements Flat Frequency Response from 60 Hz to 15 kHz for Wideband Digital Wireline Telephones standard. Low Current Consumption: <250 A Single-Ended Analog Output The INMP401 is available in a 4.72 3.76 1.00 mm surface- High PSR of 70 dB mount package. It is reflow solder compatible with no Compatible with Sn/Pb and Pb-Free Solder Processes sensitivity degradation. The INMP401 is halide free. RoHS/WEEE Compliant *Protected by U.S. Patents 7,449,356 7,825,484 7,885,423 and 7,961,897. Other patents are pending. ORDERING INFORMATION FUNCTIONAL BLOCK DIAGRAM PART TEMP RANGE INMP401ACEZ-R0* 40C to +85C INMP401ACEZ-R7 40C to +85C OUTPUT EV INMP401 OUTPUT AMPLIFIER EV INMP401-FX * 13 Tape and Reel POWER 7 Tape and reel to be discontinued. Contact INMP401 sales invensense.com for availability. VDD GND InvenSense Inc. InvenSense reserves the right to change the detail Document Number: DS-INMP401-00 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.1 +1(408) 9887339 improvements in the design of its products. Rev Date: 05/21/2014 www.invensense.com INMP401 TABLE OF CONTENTS General Description ................................................................................................................................................. 1 Applications ............................................................................................................................................................. 1 Features ................................................................................................................................................................... 1 Functional Block Diagram ........................................................................................................................................ 1 Ordering Information ............................................................................................................................................... 1 Table of Contents ............................................................................................................................................................ 2 Specifications .................................................................................................................................................................. 3 Table 1. Electrical Characteristics ............................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................ 4 Table 2. Absolute Maximum Ratings ....................................................................................................................... 4 ESD Caution ............................................................................................................................................................. 4 Soldering Profile....................................................................................................................................................... 5 Table 3. Recommended Soldering Profile* .............................................................................................................. 5 Pin Configurations And Function Descriptions ............................................................................................................... 6 Table 4. Pin Function Descriptions ........................................................................................................................... 6 Typical Performance Characteristics ............................................................................................................................... 7 Applications Information ................................................................................................................................................ 8 Connecting To Audio Codecs ................................................................................................................................... 8 Supporting Documents ................................................................................................................................................... 9 Evaluation Board User Guide ................................................................................................................................... 9 application Notes (product specific) ........................................................................................................................ 9 Application Notes (general) ..................................................................................................................................... 9 PCB Design And Land Pattern Layout ........................................................................................................................... 10 Handling Instructions .................................................................................................................................................... 11 Pick And Place Equipment ..................................................................................................................................... 11 Reflow Solder ......................................................................................................................................................... 11 Board Wash............................................................................................................................................................ 11 Outline Dimensions ....................................................................................................................................................... 12 Ordering Guide ...................................................................................................................................................... 13 Revision History ..................................................................................................................................................... 13 Compliance Declaration Disclaimer ....................................................................................................................... 14 Page 2 of 14 Document Number: DS-INMP401-00 Revision: 1.1