TLP192A TB67S112PGTOSHIBA Photocoupler Photorelay TLP192A Telecommunications Unit: mm Measurement and Control Equipment Data Acquisition System Measurement Equipment The Toshiba TLP192A consists of an infrared emitting diode optically coupled to a photo-MOSFET in a 6-pin SOP package. Because of the low offset voltage at turn-on, this photorelay is suitable for analog signal switching, eg. micro signal scan circuit of data acquisition system, subscriber circuit of digital exchange. This photorelay has higher output current rating than phototransistor- type photocoupler hence, it is suitable for use as On/Off control for high current. 6-pin SOP (2.54SOP6): Height = 2.1 mm, pitch = 2.54 mm Normally open (1-form-A) device Peak off-state voltage: 60 V (min) Trigger LED current: 3 mA (max) On-state current: 400 mA (max) JEDEC On-state resistance: 2 (max) JEITA Isolation voltage: 1500 Vrms (min) UL-recognized: UL 1577, File No.E67349 TOSHIBA 11-7C1 cUL-recognized: CSA Component Acceptance Service No.5A Weight: 0.13 g (typ.) File No.E67349 Pin Configuration (top view) 1 6 1: Anode 2: Cathode 2 5 4: Drain D1 5: Source 6: Drain D2 3 4 Schematic 1 6 2 5 4 Start of commercial production 2002-03 2019 1 2019-06-17 Toshiba Electronic Devices & Storage Corporation TLP192A Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Forward current I 50 mA F Forward current derating (Ta 25 C) I /C 0.5 mA/C F Peak forward current I 1 A FP (100 s pulse, 100 pps) LED Reverse voltage V 5 V R P 50 mW Diode power dissipation D P /C -0.5 mW/C Diode power dissipation derating (Ta >25 C) D Junction temperature T 125 C j Off-state output terminal voltage V 60 V OFF A connection 400 On-state B connection I 400 mA ON current C connection 800 A connection 4.0 Forward Detector current B connection I /C 4.0 mA/C ON derating (Ta 25 C) C connection 8.0 Output power dissipation P 256 mW O Output power dissipation derating (Ta 25 C) P / C 2.56 mW / C O Junction temperature T 125 C j Storage temperature T 55 to 125 C stg Operating temperature T 40 to 85 C opr Lead soldering temperature (10 s) T 260 C sol Isolation voltage BV 1500 Vrms S (AC, 60 s, R.H. 60 %) (Note 1) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: LED pins are shorted together. Detector pins are also shorted together. Recommended Operating Conditions Characteristics Symbol Min Typ. Max Unit Supply voltage V 48 V DD Forward current I 5 7.5 25 mA F On-state current I 400 mA ON Operating temperature T 20 65 C opr Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2019 2 2019-06-17 Toshiba Electronic Devices & Storage Corporation