TLP197G TOSHIBA Photocoupler IRED & Photo-MOS FET TLP197G Modem Unit: mm Fax PBX Measurement Instrumentation The TOSHIBA mini flat photo relay TLP197G is a small outline photo relay, suitable for surface mount assembly. The TLP197G consists of an infrared emitting diode optically coupled to a photo MOS FET in a six lead 2.1mm height package, which enable TLP197G to be applied in card modems. The TLP197G is a bi directional switch which can replace mechanical relays in fax machines and modems etc. SOP 6pin(2.54SOP6): 1 form A Peak offstate voltage: 350 V (min) Trigger LED current: 3 mA (max) On state current: 120 mA (max) (A connection) On state resistance: 35 (max) TOSHIBA 11-7C1 Isolation voltage: 1500 Vrms (min) Weight: 0.13g (typ.) UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5 (Note 1) Note 1 : When a VDE approved type is needed, please designate the Option(V4). Pin Configuration (top view) Schematic 1 1 : Anode 6 6 1 2 : Cathode 3 : NC 2 5 5 4 : Drain D1 2 5 : Source 3 4 4 6 : Drain D2 Start of commercial production 1996-03 2019 1 2019-06-17 Toshiba Electronic Devices & Storage Corporation TLP197G Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Forward current I 50 mA F Forward current derating (Ta 25C) I /C 0.5 mA/C F Pulse forward current (100s pulse,100pps) I 1 A FP Reverse voltage V 5 V R P 50 mW Diode power dissipation D P /C -0.5 mW/C Diode power dissipation derating (Ta >25C) D Junction temperature T 125 C j Off state output terminal voltage V 350 V OFF A connection B connection Onstate current I 120 mA ON C connection A connection Onstate current derating (Ta 25C) B connection I /C 1.2 mA/C ON C connection A connection Output power dissipation P 300 mW B connection O C connection A connection Output power dissipation derating P /C -3.0 mW /C B connection O (Ta 25C) C connection Junction temperature T 125 C j Storage temperature range T 55 to 125 C stg Operating temperature range T 40 to 85 C opr Lead soldering temperature(10 s) T 260 C sol Isolation voltage (AC, 60 s, R.H. 60 %) (Note 1) BV 1500 Vrms S Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Device considered a two terminal device: Pins1, 2 and 3 shorted together and pins 4, 5 and 6 shorted together. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Supply voltage V 280 V CC Forward current I 5 7.5 25 mA F Onstate current(A connection) I 100 mA ON Operating temperature T 20 65 C opr Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2019 2 2019-06-17 Toshiba Electronic Devices & Storage Corporation Detector Led