TLP220GF Photocouplers Photorelay TLP220GFTLP220GFTLP220GFTLP220GF 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications Mechanical relay replacements Security Systems Measuring Instruments Factory Automation (FA) Amusement Equipment Smart Meters Electricity Meters 2. 2. GeneralGeneral 2. 2. GeneralGeneral The TLP220GF photorelay consists of a photo MOSFET optically coupled to an infrared light emitting diode. It is housed in a 4-pin DIP package. It provides an isolation voltage of 5000 Vrms, making it suitable for applications that require reinforced insulation. 3. 3. 3. 3. FeaturesFeaturesFeaturesFeatures (1) Normally open (1-Form-A) (2) OFF-state output terminal voltage: 350 V (min) (3) Trigger LED current: 2 mA (max) (4) ON-state current: 100 mA (max) (5) ON-state resistance: 35 (max, t < 1s) (6) ON-state resistance: 50 (max, Continuous) (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-approved: UL1577 File No. E67349 cUL-approved: CSA Component Acceptance Service No. 5A, File No. E67349 VDE-approved: Option (D4) EN60747-5-5 (Note) Note: When an EN60747-5-5 approved type is needed, please designate the Option (D4) 4. 4. Packaging and Pin ConfigurationPackaging and Pin Configuration 4. 4. Packaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: Cathode 3: Drain 4: Drain 11-5B202S 2013-02-04 1 Rev.2.0TLP220GF 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit Fig. 5.1 Internal Circuit Fig. Fig. Fig. 5.15.15.1 Internal CircuitInternal CircuitInternal Circuit 6. 6. 6. 6. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP220G TLP220GF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) 7. 7. 7. 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, T = 25 = 25 = 25 = 25)))) aaaa Characteristics Symbol Note Rating Unit LED Input forward current I 30 mA F Input forward current derating (T 25) I /T -0.3 mA/ a F a Input forward current (pulsed) (100 s pulse, 100 pps) I 1 A FP Input reverse voltage V 5 V R Input power dissipation P 50 mW D Junction temperature T 125 j Detector OFF-state output terminal voltage V 350 V OFF ON-state current I 100 mA ON ON-state current derating (T 25) I /T -1.0 mA/ a ON a ON-state current (pulsed) (t = 100 ms, Duty = 1/10) I 300 mA ONP Output power dissipation P 500 mW O Junction temperature T 125 j Common Storage temperature T -55 to 125 stg Operating temperature T -40 to 85 opr Lead soldering temperature (10 s) T 260 sol Isolation voltage AC, 1 min, R.H. 60% BV (Note 1) 5000 Vrms S Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 2013-02-04 2 Rev.2.0