TLP2468(TP,F) Toshiba

TLP2468 Photocouplers GaAAs Infrared LED & Photo IC TLP2468TLP2468TLP2468TLP2468 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Plasma Display Panels (PDPs) Factory Automation (FA) Measuring Instruments 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2468 consists of a high-intensity GaAAs infrared light-emitting diode (LED) optically coupled to a high- gain, high-speed photoreceptor chip. The TLP2468 guarantees operation at up to 125 and wide range operation of power-supply voltage (2.7V to 5.5V). The TLP2468 has an open-collector output and is offered in the SO8 package. An internal noise shield provides superior common-mode rejection of 15 kV/s for improved noise immunity. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO8 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.) (NRZ) (6) Threshold input current: 5.0 mA (max) (7) Supply current: 4 mA (max) (8) Common-mode transient immunity: 15 kV/s (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) Option (V4) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (V4)Option (V4)Option (V4). Start of commercial production 2010-09 2015 Toshiba Corporation 2015-10-26 1 Rev.6.0TLP2468 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: N.C 2: Anode 3: Cathode 4: N.C 5: GND 6: V (Output) O 7: N.C 8: V CC 11-5K1S 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. Truth Table 6.1. 6.1. 6.1. Truth TableTruth TableTruth Table Input LED Output H ON L L OFF H 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 4.0 mm Clearance distances 4.0 Internal isolation thickness 2015 Toshiba Corporation 2015-10-26 2 Rev.6.0