TLP331(F) Toshiba

Semiconductor Catalog 2012-10 Photocouplers and Photorelays SEMICONDUCTOR & STORAGE PRODUCTS Preface Extensive Line of Products As a type of isolator favored by manufacturers, photocouplers To meet customers various needs, we offer an extensive now serve as noise protectors in many electronic devices. product portfolio shown below as well as general- Toshibas photocouplers consist of either a GaAs or GaA As purpose photocouplers. infrared LED(s) and a silicon photodetector(s) housed in a mold 1. Photo-IC couplers: High speed and advanced functions package. GaA As LEDs are adopted in high-speed photo-IC (highly integrated detectors) types due to their high-speed and high-light output. 2. Zero-crossing phototriac couplers: Phototriac-output devices with zero-crossing detection 3. Photovoltaic couplers: MOSFET gate drive (high voltage White overmold (epoxy) output achieved using a photodiode array) Detector 4. Photorelays (MOSFET-output devices): Dome (silicon) AC-DC switches (MOSFET output) Infrared LED Mechanical relay replacement Lead frame Safety Standard Approvals UL approval has been obtained under file number E67349 for Perspective view Cross section most of our photocouplers. EN60747-5-2- or EN60747-5-5- of the TLP523 of the TLP523 approved photocouplers are also offered with a wide selection of output (transistor, thyristor, triac, IC output and photorelay). The designs of these devices meet other standards including IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (SO6) and half-pitch (1.27 mm) mini-flat SOP packages. CONTENTS .............................................................................................................. 1. Product Index 3 2. Package Dimensions 45 ..................................................................................................................... 2. New Products 5 3. Rank Marking 52 ......................................................................................... 3. Photocoupler Product Tree 10 7. Packing Information 54 ......................................................... 4. Selection Guide 11 1. Photocoupler Magazine Packing ............................................................. 1. Transistor-Output and Darlington-Transistor- Specifications 54 ................................................................................ Output Photocouplers 11 2. Tape-and-Reel Specifications 56 ................................................................. 2. Photocouplers for Logic Signal Transmission 18 8. Board Assembly 59 ................................................ 3. Photocouplers for IGBT/MOSFET Gate Drive 25 1. Example Land Patterns 59 ................................................ 4. Photorelays (1-Form-A and 2-Form-A) 29 2. Board Assembly Considerations 60 ................................................... 5. Photorelays 9. Device Degradation 61 ...... (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B) 37 1. Projected Operating Life Based on LED Light ....................................................................................... 6. Triac-Output Photocouplers 38 Output Degradation 61 .................................................................... 7. Thyristor-Output Photocouplers 41 10. Safety Standard Approvals 68 ..................................... 8. Photovoltaic-Output photocouplers 42 11. Photocoupler Application Circuit Examples 70 ........................................................................... 5. Part Naming Conventions 43 12. Competitor Cross Reference 82 .................................................. 6. Package Information 44 ..................... 1. Lead Form Options for DIP Packages 44 2