TLP3555A,TLP3555AF Photocouplers Photorelay TLP3555A,TLP3555AFTLP3555A,TLP3555AFTLP3555A,TLP3555AFTLP3555A,TLP3555AF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Heating, ventilation and air conditioning (HVAC) Mechanical relay replacements ATE (Automatic Test Equipment) Factory Automation (FA) Security Systems 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP3555A and TLP3555AF photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 4-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3555A and TLP3555AF make it suitable for power line control applications. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 60 V (min) (3) Trigger LED current: 3 mA (max) (4) ON-state current: 3 A (max) (5) ON-state resistance: 100 m (max) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) UL-recognized: UL 508, File No.E499232 (Note 1)(Note 1)(Note 1) (Note 2) VDE-approved: EN 60747-5-5 (Note 2)(Note 2)(Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Option (D4) Note 2: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm pitch 10.16-mm pitch Characteristics Unit TLP3555A TLP3555AF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2018-05 2017-2020 2020-03-25 1 Toshiba Electronic Devices & Storage Corporation Rev.3.0TLP3555A,TLP3555AF 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP3555A TLP3555A(LF1,TP1) TLP3555A(LF5,TP5) 11-5B201S 11-5B205S 11-5B2S TLP3555AF TLP3555AF(LF4,TP4) 11-5B204S 11-5B202S Note: Through-hole type: TLP3555A, TLP3555AF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. 6. 6. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7. 7. 7. 7. Internal CircuitInternal CircuitInternal CircuitInternal Circuit Fig. Fig. Fig. Fig. 7.17.17.17.1 Internal CircuitInternal CircuitInternal CircuitInternal Circuit 2017-2020 2020-03-25 2 Toshiba Electronic Devices & Storage Corporation Rev.3.0