TLP3558A,TLP3558AF Photocouplers Photorelay TLP3558A,TLP3558AFTLP3558A,TLP3558AFTLP3558A,TLP3558AFTLP3558A,TLP3558AF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Mechanical relay replacements Factory Automation (FA) Security Systems Measuring Instruments I/O Interface Boards 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP3558A and TLP3558AF photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 4-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3558A and TLP3558AF make it suitable for power line control applications. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 200 V (min) (3) Trigger LED current: 3 mA (max) (4) ON-state current: 0.7 A (max) (5) ON-state resistance: 2 (max) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) UL-recognized: UL 508, File No.E499232 (Note 1)(Note 1)(Note 1) (Note 2) VDE-approved: EN 60747-5-5 (Note 2)(Note 2)(Note 2) (Note 1):Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Option (D4) (Note 2):When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm pitch 10.16-mm pitch Characteristics Unit TLP3558A TLP3558AF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2017-12 2017-2020 2020-03-25 1 Toshiba Electronic Devices & Storage Corporation Rev.3.0TLP3558A,TLP3558AF 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP3558A TLP3558A(LF1,TP1) TLP3558A(LF5,TP5) 11-5B201S 11-5B205S 11-5B2S TLP3558AF TLP3558AF(LF4,TP4) 11-5B204S 11-5B202S Note: Through-hole type: TLP3558A, TLP3558AF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. 6. 6. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7. 7. 7. 7. Internal CircuitInternal CircuitInternal CircuitInternal Circuit Fig. Fig. Fig. Fig. 7.17.17.17.1 Internal CircuitInternal CircuitInternal CircuitInternal Circuit 2017-2020 2020-03-25 2 Toshiba Electronic Devices & Storage Corporation Rev.3.0