TLP3556A,TLP3556AF Photocouplers Photorelay TLP3556A,TLP3556AFTLP3556A,TLP3556AFTLP3556A,TLP3556AFTLP3556A,TLP3556AF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Mechanical relay replacements Security Systems Heating, ventilation and air conditioning (HVAC) ATE (Automatic Test Equipment) Factory Automation (FA) Battery Management System (BMS) 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP3556A and TLP3556AF photorelay consists of a photo MOSFET optically coupled to an infrared LED. It is housed in a 4-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3556A and TLP3556AF make it suitable for power line control applications. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 100 V (min) (3) Trigger LED current: 3 mA (max) (4) ON-state current: 2 A (max) (5) ON-state resistance: 200 m (max) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) UL-recognized: UL 508, File No.E499232 (Note 1)(Note 1)(Note 1) (Note 2) VDE-approved: EN 60747-5-5 (Note 2)(Note 2)(Note 2) (Note 1):Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Option (D4) (Note 2):When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm pitch 10.16-mm pitch Characteristics Unit TLP3556A TLP3556AF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2017-12 2017-2020 2020-03-25 1 Toshiba Electronic Devices & Storage Corporation Rev.5.0TLP3556A,TLP3556AF 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP3556A TLP3556A(LF1,TP1) TLP3556A(LF5,TP5) 11-5B201S 11-5B205S 11-5B2S TLP3556AF TLP3556AF(LF4,TP4) 11-5B204S 11-5B202S Note: Through-hole type: TLP3556A, TLP3556AF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. 6. 6. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7. 7. 7. 7. Internal CircuitInternal CircuitInternal CircuitInternal Circuit Fig. Fig. Fig. Fig. 7.17.17.17.1 Internal CircuitInternal CircuitInternal CircuitInternal Circuit 2017-2020 2020-03-25 2 Toshiba Electronic Devices & Storage Corporation Rev.5.0
