TLP627M,TLP627MF Photocouplers Infrared LED & Photo Darlington Transistor TLP627M,TLP627MFTLP627M,TLP627MFTLP627M,TLP627MFTLP627M,TLP627MF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Programmable Logic Controllers (PLCs) I/O Interface Boards Home Electric Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral TLP627M is a photocoupler that consists of an infrared emitting diode optically coupled to a photo darlington transistor. Housed in a 4pin DIP, it has a high noise immunity and high insulation. With the high breakdown voltage between the collector and emitter, TLP627M is suitable in applications such as 100 V DC output modules of programmable controllers. TLP627MF is a lead forming type for the long creepage mounting of TLP627M. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Collector-emitter voltage: 300 V (min) (2) Current transfer ratio: 1000 % (min) ( I = 1 mA, V = 1 V) F CE (3) Isolation voltage: 5000 Vrms (min) (4) Operating temperature: -55 to 110 (5) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory (Pending) Option (D4)Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4). Start of commercial production 2018-12 2018 2018-12-06 1 Toshiba Electronic Devices & Storage Corporation Rev.1.0TLP627M,TLP627MF 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP627M TLP627M(LF1,TP1) TLP627M(LF5,TP5) 11-5B201S 11-5B205S 11-5B2S TLP627MF TLP627MF(LF4,TP4) 11-5B204S 11-5B202S Note: Through-hole type: TLP627M, TLP627MF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 5. 5. 5. 5. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: Cathode 3: Emitter 4: Collector 6. 6. Mechanical ParametersMechanical Parameters 6. 6. Mechanical ParametersMechanical Parameters 7.62 mm pitch 10.16 mm pitch Characteristics TLP627M type TLP627MF type Unit (Min) (Min) Creepage distances 7.0 8.0 mm Clearance 7.0 8.0 Internal isolation thickness 0.4 0.4 2018 2018-12-06 2 Toshiba Electronic Devices & Storage Corporation Rev.1.0