TLP700AF(F) Toshiba

TLP700AF Photocouplers GaAAs Infrared LED & Photo IC TLP700AFTLP700AFTLP700AFTLP700AF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Industrial Inverters Air Conditioner Inverters MOSFET Gate Drivers IGBT Gate Drivers Induction Cooktop and Home Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP700AF is a photocoupler in a 6-pin SDIP package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 110. The TLP700AF is physically smaller than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed commonmode transient immunity of 20 kV/s. It is ideal for IGBT and power MOSFET gate drive. Leads of the TLP700AF is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and electrical characteristics are the same as in the TLP700A. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 200 ns (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory Option (D4) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2012-01 2016 Toshiba Corporation 2016-02-17 1 Rev.4.0TLP700AF 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: Output 6: V CC 11-5J101S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. Principle of OperationPrinciple of Operation 6. 6. Principle of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. Mechanical ParametersMechanical Parameters 6.2. 6.2. Mechanical ParametersMechanical Parameters 10.16 mm Pitch Characteristics Unit TLP700AF Creepage distances 8.0 (min) mm Clearance distances 8.0 (min) Internal isolation thickness 0.4 (min) 2016 Toshiba Corporation 2016-02-17 2 Rev.4.0